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VEML6075

P1-P3P4-P6P7-P9P10-P11
VEML6075
www.vishay.com
Vishay Semiconductors
Rev. 1.2, 23-Nov-16
7
Document Number: 84304
For technical questions, contact: sensorstechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Command Register Format
The VEML6075 has 16-bit registers used to set up the measurements as well as pick up the measurement results. The
description of each command format is shown in the following tables.
TABLE 2 - REGISTER UV_CONF DESCRIPTION
REGISTER NAME COMMAND CODE: 0x00_L (0x00 DATA BYTE LOW) OR 0x00_H (0x00 DATA BYTE HIGH)
COMMANDBIT76543210
REGISTER: UV_CONF COMMAND CODE: 0x00_L (0x00 DATA BYTE LOW)
COMMAND BIT Description
Reserved 7 0
UV_IT 6 : 4
(0 : 0 : 0) = 50 ms, (0 : 0 : 1) = 100 ms, (0 : 1 : 0) = 200 ms, (0 : 1 : 1) = 400 ms, (1 : 0 : 0) = 800 ms,
(1 : 0 : 1) = reserved, (1 : 1 : 0) = reserved, (1 : 1 : 1) = reserved.
HD 3 0 = normal dynamic setting, 1 = high dynamic setting
UV_TRIG 2
0 = no active force mode trigger, 1 = trigger one measurement
With UV_AF = 1 the VEML6075 conducts one measurement every time the host writes UV_Trig = 1. This bit
returns to “0” automatically.
UV_AF 1 0 = active force mode disable (normal mode), 1 = active force mode enable
SD 0 0 = power on, 1 = shut down
TABLE 3 - REGISTER 00_H DESCRIPTION
REGISTER: reserved COMMAND CODE: 0x00_H (0x00 DATA BYTE HIGH)
COMMAND BIT Description
Reserved 7 : 0 Default = (0 : 0 : 0 : 0 : 0 : 0 : 0 : 0)
TABLE 4 - REGISTER 01_L TO 06_L AND 08_L; 01_H TO 06_H AND 08_H DESCRIPTION
REGISTER: reserved
COMMAND CODE: 0x01_L TO 0x06_L AND 0x08_L (0x01 TO 0x06 AND 0x08_L DATA BYTE LOW)
COMMAND CODE: 0x01_H TO 0x06_H AND 0x08_H (0x01 TO 0x06 AND 0x08_H DATA BYTE HIGH)
REGISTER BIT Description
Reserved 7 : 0 Default = (0 : 0 : 0 : 0 : 0 : 0 : 0 : 0)
Reserved 7 : 0 Default = (0 : 0 : 0 : 0 : 0 : 0 : 0 : 0)
TABLE 5 - READ OUT COMMAND CODES DESCRIPTION
REGISTER COMMAND CODE BIT DESCRIPTION
UVA_DATA
0x07_L (0x07 data byte low) 7 : 0 0x00 to 0xFF, UVA LSB output data
0x07_H (0x07 data byte high) 7 : 0 0x00 to 0xFF, UVA MSB output data
UVB_DATA
0x09_L (0x09 data byte low) 7 : 0 0x00 to 0xFF, UVB LSB output data
0x09_H (0x09 data byte high) 7 : 0 0x00 to 0xFF, UVB MSB output data
UVCOMP1_DATA
0x0A_L (0x0A data byte low) 7 : 0 0x00 to 0xFF, UV
comp1
LSB output data
0x0A_H (0x0A data byte high) 7 : 0 0x00 to 0xFF, UV
comp1
MSB output data
UVCOMP2_DATA
0x0B_L (0x0B data byte low) 7 : 0 0x00 to 0xFF, UV
comp2
LSB output data
0x0B_H (0x0B data byte high) 7 : 0 0x00 to 0xFF, UV
comp2
MSB output data
ID
0x0C_L (0x0C data byte low) 7 : 0 Default = 0x26, device ID LSB byte
0x0C_H (0x0C data byte high)
7 : 6
5 : 4
3 : 0
Company code = 00, (0 : 0),
slave address = 0x20,
version code (0 : 0 : 0 : 0) = VEML6075 CS,
device ID MSB byte
VEML6075
www.vishay.com
Vishay Semiconductors
Rev. 1.2, 23-Nov-16
8
Document Number: 84304
For technical questions, contact: sensorstechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Data Access
VEML6075 has 16-bit high resolution sensitivity for each UV channel. One byte is the LSB and the other byte is the MSB. The
host needs to follow the read word protocol as shown in fig. 7. The data format shows as below.
Note
• Data byte low represents LSB and data byte high represents MSB.
Data Auto-Memorization
VEML6075 keeps the last results read. These values will remain in the registers, and can be read from these registers, until the
device wakes up and a new measurement is made.
UV-Index Calculation
In order to use the result data to calculate the UV-Index, please refer to the “Designing the VEML6075 into an Application”
application note (www.vishay.com/doc?84339
).
PACKAGE INFORMATION in millimeters
Fig. 8 - VEML6075 A3OP Package Dimensions
TABLE 6 - 16-BIT DATA FORMAT
VEML6075 16-BIT DATA FORMAT
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Data byte low
Data byte high
Receive byte Read data from VEML6075
Host action
VEML6075 response
SSlave address A Command code
A Data byte (LSB) A PData byte (MSB) N
Wr
SSlave address
Rd
A
S = start condition
P = stop condition
A = acknowledge
N = no acknowledge
SIDE VIEW
0.56
DIE
30 μm ± 10 μm
0.1
0.45
1 ± 0.10
TOP VIEW
XX’
1 4
2 3
1.00 ± 0.15
0.625 ± 0.15
2.00 ± 0.15
1.25 ± 0.15
X’ X’
1.100.45 ± 0.05
2
14
3
0.55 ± 0.05
1.0
0 to 0.04
0 to 0.02
0 to 0.05
0 to 0.06
0.25
0.70
0.1
0.35 ± 0.05
3
Package edge to edge
2 ± 0.15
1
2 3
4
0.35
0.1
0.7
0.5
0.40.6
PAD AND CIRCUIT LAYOUT REFERENCE
VEML6075
www.vishay.com
Vishay Semiconductors
Rev. 1.2, 23-Nov-16
9
Document Number: 84304
For technical questions, contact: sensorstechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RECOMMENDED INFRARED REFLOW
Soldering conditions which are based on J-STD-020 C.
Recommend Normal Solder Reflow is 235 °C to 255 °C
Fig. 9 - VEML6075 OPLGA Solder Reflow Profile Chart
RECOMMENDED IRON TIP SOLDERING CONDITION AND WARNING HANDLING
1. Solder the device with the following conditions:
1.1. Soldering temperature: 400 °C (max.)
1.2. Soldering time: 3 s (max.)
2. If the temperature of the method portion rises in addition to the residual stress between the leads, the possibility that an
open or short circuit occurs due to the deformation or destruction of the resin increases.
3. The following methods: VPS and wave soldering, have not been suggested for the component assembly.
4. Cleaning method conditions:
4.1. Solvent: methyl alcohol, ethyl alcohol, isopropyl alcohol
4.2. Solvent temperature < 45 °C (max.)
4.3. Time: 3 min (min.)
RECOMMENDED STORAGE AND REBAKING CONDITIONS
PARAMETER CONDITIONS MIN. MAX. UNIT
Storage temperature 5 50 °C
Relative humidity - 60 %
Open time - 168 h
Total time From the date code on the aluminized envelope (unopened) - 12 months
Rebaking
Tape and reel: 60 °C - 22 h
Tube: 60 °C - 22 h
IR REFLOW PROFILE CONDITION
PARAMETER CONDITIONS TEMPERATURE TIME
Peak temperature 255 °C + 0 °C / - 5 °C (max.: 260 °C) 10 s
Preheat temperature range and timing 150 °C to 200 °C 60 s to 180 s
Timing within 5 °C to peak temperature - 10 s to 30 s
Timing maintained above temperature / time 217 °C 60 s to 150 s
Timing from 25 °C to peak temperature - 8 min (max.)
Ramp-up rate 3 °C/s (max.) -
Ramp-down rate 6 °C/s (max.) -
200
150
217
255
Temperature (°C)
Time (s)
t
2
t
1
Max. Temperature
(260 °C + 5 °C / - 5 °C)/10 s
Ramp-Down Rate
6 °C/s (max.)
Ramp-Up Rate
3 °C/s (max.)
Soldering Zone
60 s to 150 s
Ramp-Up Rate
3 °C/s (max.)
Pre-Heating Time
t
2
- t
1
= 60 s to 180 s
P1-P3P4-P6P7-P9P10-P11

VEML6075

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