MC100EPT26
www.onsemi.com
4
Table 5. TTL OUTPUT DC CHARACTERISTICS (V
CC
= 3.3 V; GND = 0.0 V; T
A
= −40°C to 85°C)
Symbol
Characteristic Condition Min Typ Max Unit
V
OH
Output HIGH Voltage I
OH
= −3.0 mA 2.4 V
V
OL
Output LOW Voltage I
OL
= 24 mA 0.5 V
I
CCH
Power Supply Current 10 25 35 mA
I
CCL
Power Supply Current 15 34 40 mA
I
OS
Output Short Circuit Current −50 −150 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 6. AC CHARACTERISTICS (V
CC
= 3.0 V to 3.6 V; GND = 0.0 V (Note 1))
Symbol
Characteristic
−40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
f
max
Maximum Frequency (Figure 2) 275 350 275 350 275 350 MHz
t
PLH
,
t
PHL
Propagation Delay to
Output Differential (Note 2)
1.2
1.2
1.5
1.5
2.0
1.8
1.2
1.2
1.5
1.5
2.0
1.8
1.3
1.2
1.7
1.5
2.2
1.8
ns
t
SK+
+
t
SK−
−
t
SKPP
Within Device Skew + +
Within Device Skew − −
Device-to-Device Skew (Note 3)
15
20
100
60
85
500
15
20
100
60
85
500
20
30
100
85
85
500
ps
t
JITTER
Random Clock Jitter (RMS) (Figure 2)
@ ≤ 200 MHz
@ > 200 MHz
6
20
30
275
6
40
30
275
6
170
30
275
ps
V
PP
Input Voltage Swing (Differential Configuration) 150 800 1200 150 800 1200 150 800 1200 mV
t
r
t
f
Output Rise/Fall Times
(0.8 V−2.0 V) Q, Q
330 600 950 330 600 950 330 650 950
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Measured with a 750 mV 50% duty-cycle clock source. R
L
= 500 W to GND and C
L
= 20 pF to GND. Refer to Figure 3.
2. Reference (V
CC
= 3.3 V ± 5%; GND = 0 V)
3. Skews are measured between outputs under identical transitions.
Figure 2. Typical V
OH
/ Jitter versus Frequency (255C)
FREQUENCY (MHz)
V
OH
(V)
0.0
1.0
2.0
3.0
V
OH
V
OL
0.5 V
JITTER
RANDOM CLOCK JITTER (ps RMS)
12
8
4
0
0 100 200 300
