EL5211T
13
FN6893.0
May 12, 2010
possible and the power supply pins must be well
bypassed to reduce any risk of oscillation.
For normal single supply operation (the V
S
- pin is
connected to ground) a 4.7µF capacitor should be placed
from V
S
+ to ground, then a parallel 0.1µF capacitor
should be connected as close to the amplifier as possible.
One 4.7µF capacitor may be used for multiple devices.
For dual supply operation, the same capacitor
combination should be placed at each supply pin to
ground.
It is highly recommended that EL5211T exposed thermal
pad packages should always have the pad connected to
the lowest potential, V
S
-, to optimize thermal and
operating performance. PCB vias should be placed below
the device’s exposed thermal pad to transfer heat to the
V
S
- plane and away from the device.
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The
Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,
handheld products, and notebooks. Intersil's product families address power management and analog signal
processing functions. Go to www.intersil.com/products
for a complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device
information page on intersil.com: EL5211T
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
DATE REVISION CHANGE
5/12/10 FN6893.0 Initial Release.
2/24/10 FN6893.0 Pre-release data sheet submitted for formatting.
