APTM20DAM05G

APTM20DAM05G
APTM20DAM05G
Rev 3 July, 2006
www.microsemi.com 1
6
G2
S2
VB US
0/VBUS
CR1
OUT
Q2
OUT
0/VBUSVBUS
G2
S2
Absolute maximum ratings
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
S
ymbol Parameter Max ratings Unit
V
DSS
Drain - Source Breakdown Voltage 200 V
T
c
= 25°C 317
I
D
Continuous Drain Current
T
c
= 80°C 237
I
DM
Pulsed Drain current 1268
A
V
GS
Gate - Source Voltage ±30 V
R
DSon
Drain - Source ON Resistance 6
m
P
D
Maximum Power Dissipation T
c
= 25°C 1136 W
I
AR
Avalanche current (repetitive and non repetitive) 89 A
E
AR
Repetitive Avalanche Energy 50
E
AS
Single Pulse Avalanche Energy 2500
mJ
V
DSS
= 200V
R
DSon
= 5m typ @ Tj = 25°C
I
D
= 317A @ Tc = 25°C
Applicatio
n
AC and DC motor control
Switched Mode Power Supplies
Power Factor Correction
Features
Power MOS 7
®
MOSFETs
- Low R
DSon
- Low input and Miller capacitance
- Low gate c harge
- Avalanche energy rated
- Very rugged
Kelvin source for easy drive
Very low stray inductance
- Symmetrical design
- M5 power connectors
High level of integration
Benefits
Outsta ndi ng performance at hi gh freque nc y operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Low profile
RoHS Compliant
B
oost choppe
r
MOSFET Power Module
APTM20DAM05G
APTM20DAM05G
Rev 3 July, 2006
www.microsemi.com 2
6
All ratings @ T
j
= 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
V
GS
= 0V,V
DS
= 200V T
j
= 25°C 400
I
DSS
Zero Gate Voltage Drain Current
V
GS
= 0V,V
DS
= 160V T
j
= 125°C 2000
µA
R
DS(on)
Drain – Source on Resistance V
GS
= 10V, I
D
= 158.5A
5 6
m
V
GS(th)
Gate Threshold Voltage V
GS
= V
DS
, I
D
= 10mA 3 5 V
I
GS S
Gate – Source Leakage Current V
GS
= ±30 V, V
DS
= 0V ±200 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
C
is s
Input Capacitance 27.4
C
oss
Output Capacitance 8.72
C
rss
Reverse Transfer Capacitance
V
GS
= 0V
V
DS
= 25V
f = 1MHz
0.38
nF
Q
g
Total gate Charge 448
Q
gs
Gate – Source Charge 172
Q
gd
Gate – Drain Charge
V
GS
= 10V
V
Bus
= 100V
I
D
= 300A
188
nC
T
d(on)
Tur n-on Delay Ti me 28
T
r
Rise Time 56
T
d(off)
Turn-off Delay Time 81
T
f
Fall Time
Inductive switching @ 125°C
V
GS
= 15V
V
Bus
= 133V
I
D
= 300A
R
G
= 1.2
99
ns
E
on
Tur n-on Switchi ng Energy 1852
E
off
Turn-off Switching Energy
Inductive switching @ 25°C
V
GS
= 15V, V
Bus
= 133V
I
D
= 300A,
R
G
= 1.2 1820
µJ
E
on
Tur n-on Switchi ng Energy 2432
E
off
Turn-off Switching Energy
Inductive switching @ 125°C
V
GS
= 15V, V
Bus
= 133V
I
D
= 300A,
R
G
= 1.2
2124
µJ
Chopper diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
V
RRM
Maximum Peak Repetitive Reverse Voltage 200 V
T
j
= 25°C 350
I
RM
Maximum Reverse Leakage Current V
R
=200V
T
j
= 125°C 1000
µA
I
F
DCForward Current T
c
= 85°C 240 A
I
F
= 240A 1.1 1.15
I
F
= 480A 1.4 V
F
Diode Forward Voltage
I
F
= 240A T
j
= 125°C
0.9
V
T
j
= 25°C 31
t
rr
Reverse Recovery Time
T
j
= 125°C 60
ns
T
j
= 25°C 240
Q
rr
Reverse Recovery Charge
I
F
= 240A
V
R
= 133V
di/dt = 800A/µs
T
j
= 125°C 1000
nC
APTM20DAM05G
APTM20DAM05G
Rev 3 July, 2006
www.microsemi.com 3
6
Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
Transistor 0.11
R
thJC
Junction to Case Thermal Resistance
Diode 0.23
°C/W
V
ISOL
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
2500 V
T
J
Operating junction temperature range
-40 150
T
STG
Storage Temperature Range -40 125
T
C
Operating Case Temperature -40 100
°C
To heatsink M6 3 5
Torque Mounting torque
For terminals M5 2 3.5
N.m
Wt Package Weight 280 g
SP6 Package outline (dimensions in mm)
See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com

APTM20DAM05G

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
Discrete Semiconductor Modules Power Module - Mosfet
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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