NCP167
www.onsemi.com
12
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
D2
BOTTOM VIEW
b
e
4X
NOTE 3
2X
0.05 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.05 C
A
A1
(A3)
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L
4X
1
2
DIM MIN MAX
MILLIMETERS
A 0.33 0.43
A1 0.00 0.05
A3 0.10 REF
b 0.15 0.25
D 1.00 BSC
D2 0.43 0.53
E 1.00 BSC
e 0.65 BSC
L 0.20 0.30
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MOUNTING FOOTPRINT*
1.20
0.26
0.24
4X
DIMENSIONS: MILLIMETERS
0.39
RECOMMENDED
PACKAGE
OUTLINE
NOTE 4
e/2
D2
455
A
M
0.05 BC
4
3
0.65
PITCH
DETAIL A
4X
b2 0.02 0.12
L2 0.07 0.17
4X
0.52
2X
0.11
4X
L24X
DETAIL A
b24X
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NCP167/D
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