Mounting instructions
1 Soldering
1.1 Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering Iron soldering
Bath temperature max. 260 °C max. 360 °C
Soldering time max. 4 s max. 2 s
Distance from thermistor min. 6 mm min. 6 mm
Under more severe soldering conditions the resistance may change.
1.2 Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
should be used. In addition, soldering methods should be employed which permit short soldering
times.
2 Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
3 Robustness of terminations (leaded types)
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feed-
throughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Tensile strength: Test Ua1:
Leads ∅ ≤0.25 mm = 1.0 N
0.25 < ∅ ≤0.35 mm = 2.5 N
0.35 < ∅ ≤0.50 mm = 5.0 N
0.50 < ∅ ≤0.80 mm = 10.0 N
0.80 < ∅ ≤1.25 mm = 20.0 N
Temperature measurement B57560G, B57560G1
Glass-encapsulated sensors G560/G1560
Page 11 of 18Please read Cautions and warnings and
Important notes at the end of this document.
