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STPS5H100B-TR

P1-P3P4-P6P7-P9P10-P10
Characteristics STPS5H100
4/10 DocID5388 Rev 12
Figure 9. Thermal resistance junction to ambient versus copper surface under tab
Figure 7. Junction capacitance versus reverse
voltage applied (typical values)
Figure 8. Forward voltage drop versus forward
current (maximum values)
1 10 100
10
100
1000
VR(V)
C(pF)
F=1MHz
Tj=25°C
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
0.1
1.0
10.0
50.0
VFM(V)
IFM(A)
Tj=25°C
Tj=125°C
0
10
20
30
40
50
60
70
80
90
100
02468101214161820
S(cm²)
R
th(j-a)
(°C/W)
epoxy printed board FR4, copper thickness
= 35 µm
DocID5388 Rev 12 5/10
STPS5H100 Package Information
10
2 Package Information
• Epoxy meets UL94,V0
• Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 10. DPAK dimension definitions
Note: This package drawing may slightly differ from the physical package. However, all the
specified dimensions are guaranteed.
L1
L
A1
R
R
D
c
A
c2
V2
A2
H
L4
e1
e
b
L2
E
b4
Gauge
plane
0.25
D1
D
E1
Thermal pad
Package Information STPS5H100
6/10 DocID5388 Rev 12
Figure 11. DPAK footprint dimensions (in mm)
Table 5. DPAK dimension values
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 2.18 2.40 0.085 0.094
A1 0.90 1.1 0.035 0.043
A2 0.03 0.23 0.001 0.01
b 0.64 0.90 0.025 0.035
b4 4.95 5.46 0.195 0.215
c 0.46 0.61 0.018 0.024
c2 0.46 0.60 0.018 0.024
D 5.97 6.22 0.235 0.245
D1 5.10 0.201
E 6.35 6.73 0.250 0.265
E1 4.32 0.170
e1 4.4 4.7 0.173 0.185
H 9.35 10.40 0.368 0.407
L 1.0 1.78 0.039 0.070
L2 1.27 0.05
L4 0.6 1.02 0.024 0.040
V2 0° 8° 0° 8°
P1-P3P4-P6P7-P9P10-P10

STPS5H100B-TR

Mfr. #:
Buy STPS5H100B-TR
Manufacturer:
STMicroelectronics
Description:
Schottky Diodes & Rectifiers 5.0 Amp 100 Volt
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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