LQH2HPZ150MJRL

Spec No. JELF243A-9129B-01 P4/9
MURATA MFG.CO., LTD
Reference Onl
y
8.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
8.3 Pull Strength
Embossed carrier tape 10N min.
Cover tape 5N min.
8.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force
0.2 to 0.7N
(minimum value is typical)
8.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
8.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) < Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) < Expression of RoHS marking > ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
8.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,
Quantity, etc ・・・
165 to 180 degree
F
Cover tape
Plastic tape
190 min
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
210 min
φ
60±
13±1.4
φ
180
±
0
3
1
0
(in mm)
Trailer
:
160 min.
Direction of feed
Empty tape
Leader
Cover tape
Label
0
1
Spec No. JELF243A-9129B-01 P5/9
MURATA MFG.CO., LTD
Reference Only
8.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity
of an order.
9. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Disaster prevention / crime prevention equipment
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment
(8) Transportation equipment (trains, ships, etc.)
(4) Power plant control equipment
(9) Applications of similar complexity and /or reliability
(5) Medical equipment
requirements to the applications listed in the above.
10. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
10.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
(in mm)
10.2 Flux, Solder
Flux
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100μm to 150μm
Other flux (except above) Please contact us for details, then use.
W
D
Label
H
Spec No. JELF243A-9129B-01 P6/9
MURATA MFG.CO., LTD
Reference Onl
y
10.3 soldering conditions (Reflow)
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited
to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference
is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
10.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3 (+1,-0)s
Times 2 times
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the products due to the thermal shock.
10.5 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
Products shall be located in the sideways
direction (Length:a
<b) to the mechanical stress.
150
90s±30s
Time(s)
245℃±3℃
Temp.
(℃)
220℃
30s~60s
180
260℃
230℃
60s max
Limit Profile
Standard Profile
Poor example
Good example
b
a

LQH2HPZ150MJRL

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Fixed Inductors 1008 15uH 20% 690mA AEC-Q200
Lifecycle:
New from this manufacturer.
Delivery:
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