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STA333SML

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
DocID025317 Rev 2 13/17
STA333SML Package mechanical data
17
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
The STA333SML comes in a CSP 5x6 array package.
Figure 10 below shows the package outline and gives the dimensions.
Figure 10. CSP 5x6 array outline drawing
Package mechanical data STA333SML
14/17 DocID025317 Rev 2
Table 8. CSP 5x6 array package dimensions
Symbol
mm
Min. Typ. Max.
A 0.585 0.65 0.715
A1 0.210 0.25 0.29
A2 0.38 0.4 0.42
b 0.265 0.315 0.365
D 2.52 2.57 2.62
D1 2
E 3.19 3.24 3.29
E1 2.5
e 0.45 0.5 0.55
se 0.2 0.25 0.3
fD 0.277 0.285 0.293
fE 0.362 0.370 0.378
ccc 0.08
DocID025317 Rev 2 15/17
STA333SML Package mechanical data
17
4.1 Soldering information
Figure 11. Recommended soldering reflow profile for mounting on PCB
Table 9. Recommended soldering reflow values for mounting on PCB
Profile Typ. Max.
Temp. gradient in preheat (T = 70 - 180 °C) 0.9 °C/s 3 °C/s
Temp.gradient (T = 200 - 225 °C) 2 °C/s 3 °C/s
Peak temp. in reflow 240 - 245 °C 260 °C
Time above 220 °C 60 s 90 s
Temp. gradient in cooling -2 to -3 °C -6 °C
Time from 50 to 220 °C 160 to 220 s
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

STA333SML

Mfr. #:
Buy STA333SML
Manufacturer:
STMicroelectronics
Description:
Audio Amplifiers ANALOG
Lifecycle:
New from this manufacturer.
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