NB4L858MFAR2G

NB4L858M
http://onsemi.com
7
Figure 3. AC Reference Measurement
Dx
Dx
Qx
Qx
t
PHL
t
PLH
V
INPP
= V
IH
(D
X
) V
IL
(D
X
)
V
OUTPP
= V
OH
(Q
X
) V
OL
(Q
X
)
Figure 4. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8057/D)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50 W
Z
o
= 50 W
50 W 50 W
V
CC
Q
X
Q
X
V
CC
16 mA
50 W50 W
Figure 5. CML Input and Output Structure
GND
V
CC
50 W
GND
D
X
D
X
50 W
Input Output
V
TDX
R
C
R
C
NB4L858M
http://onsemi.com
8
(Q
X
Q
X
)
640 mV
MIN
320 mV
MIN
500 mV
MAX
1000 mV
MAX
Q
X
Q
X
Figure 6. CML Output Levels
Q
X
Q
X
(Q
X
Q
X
)
ORDERING INFORMATION
Device Package Shipping
NB4L858MFAG LQFP32
(PbFree)
250 Units / Tray
NB4L858MFAR2G LQFP32
(PbFree)
2000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NB4L858M
http://onsemi.com
9
PACKAGE DIMENSIONS
LQFP
FA SUFFIX
32LEAD PLASTIC PACKAGE
CASE 873A02
ISSUE B
DETAIL Y
A
S1
VB
1
8
9
17
25
32
AE
AE
P
DETAIL Y
BASE
N
J
DF
METAL
SECTION AEAE
G
SEATING
PLANE
R
Q
_
W
K
X
0.250 (0.010)
GAUGE PLANE
E
C
H
DETAIL AD
DETAIL AD
A1
B1
V1
4X
S
4X
9
T
Z
U
T−U0.20 (0.008) Z
AC
T−U0.20 (0.008) ZAB
0.10 (0.004) AC
AC
AB
M
_
8X
T, U, Z
T−U
M
0.20 (0.008) ZAC
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE
DETERMINED AT DATUM PLANE AB.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE AC.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
DIM
A
MIN MAX MIN MAX
INCHES
7.000 BSC 0.276 BSC
MILLIMETERS
B 7.000 BSC 0.276 BSC
C 1.400 1.600 0.055 0.063
D 0.300 0.450 0.012 0.018
E 1.350 1.450 0.053 0.057
F 0.300 0.400 0.012 0.016
G 0.800 BSC 0.031 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.500 0.700 0.020 0.028
M 12 REF 12 REF
N 0.090 0.160 0.004 0.006
P 0.400 BSC 0.016 BSC
Q 1 5 1 5
R 0.150 0.250 0.006 0.010
V 9.000 BSC 0.354 BSC
V1 4.500 BSC 0.177 BSC
__
___ _
B1 3.500 BSC 0.138 BSC
A1 3.500 BSC 0.138 BSC
S 9.000 BSC 0.354 BSC
S1 4.500 BSC 0.177 BSC
W 0.200 REF 0.008 REF
X 1.000 REF 0.039 REF

NB4L858MFAR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Analog & Digital Crosspoint ICs DD CLK/DATA 2X2 CRPT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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