NX2301P All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 26 October 2010 6 of 16
NXP Semiconductors
NX2301P
20 V, 2 A P-channel Trench MOSFET
7. Characteristics
[1] Pulse test: t
p
300 μs; δ≤0.01.
Table 7. Characteristics
T
j
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown
voltage
I
D
= 250 μA; V
GS
=0V 20--V
V
GS(th)
gate-source threshold
voltage
I
D
= 250 μA; V
DS
=V
GS
0.5 0.75 1.1 V
I
DSS
drain leakage current V
DS
= 20 V; V
GS
=0V - - 1 μA
I
GSS
gate leakage current V
GS
= ±8V; V
DS
=0V - - ±100 nA
R
DSon
drain-source on-state
resistance
[1]
V
GS
= 4.5 V; I
D
= 1A
T
j
=25°C 100 120 mΩ
T
j
= 150 °C - 180 mΩ
V
GS
= 2.5 V; I
D
= 1 A - 155 190 mΩ
V
GS
= 1.8 V;
I
D
= 0.2 A
- 210 270 mΩ
g
fs
forward
transconductance
V
DS
= 5V; I
D
= 2A
[1]
-4.7-S
Dynamic characteristics
Q
G(tot)
total gate charge I
D
= 2.2 A; V
DS
= 6V;
V
GS
= 4.5 V
-4.56nC
Q
GS
gate-source charge - 1.1 - nC
Q
GD
gate-drain charge - 0.9 - nC
C
iss
input capacitance V
GS
=0V; V
DS
= 6V;
f=1MHz
- 380 - pF
C
oss
output capacitance - 135 - pF
C
rss
reverse transfer
capacitance
-115-pF
t
d(on)
turn-on delay time V
DD
= 6V;
R
L
=6Ω;
V
GS
= 4.5 V;
R
G
=6Ω
-7-ns
t
r
rise time - 15 - ns
t
d(off)
turn-off delay time - 50 - ns
t
f
fall time - 25 - ns
Source-drain diode
V
SD
source-drain voltage I
S
= 1A; V
GS
=0V
[1]
- 0.8 1.0 V
NX2301P All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 26 October 2010 7 of 16
NXP Semiconductors
NX2301P
20 V, 2 A P-channel Trench MOSFET
T
amb
=25°CT
amb
=25°C; V
DS
= 10 V
(1) minimum values
(2) typical values
(3) maximum values
Fig 6. Output characteristics: drain current as a
function of drain-source voltage; typical
values
Fig 7. Sub-threshold drain current as a function of
gate-source voltage
T
amb
=25°C
(1) V
GS
= 1.4 V
(2) V
GS
= 1.6 V
(3) V
GS
= 1.8 V
(4) V
GS
= 2.0 V
I
D
= 2A
(1) T
amb
= 125 °C
(2) T
amb
=25°C
Fig 8. Drain-source on-state resistance as a function
of drain current; typical values
Fig 9. Drain-source on-state resistance as a function
of gate-source voltage; typical values
V
DS
(V)
0.0 5.04.02.0 3.01.0
017aaa098
1.0
2.0
3.0
I
D
(A)
0.0
1.8 V
1.6 V
1.4 V
V
GS
= 2.0 V
1.2 V
017aaa099
V
GS
(V)
0.0 1.51.00.5
10
4
10
5
10
3
I
D
(A)
10
6
(2)(1)
(3)
I
D
(A)
0.0 2.52.01.0 1.50.5
017aaa100
0.50
0.25
0.75
1.0
R
DSon
(Ω)
0.0
(1) (2)
(3)
(4)
V
GS
(V)
0.0 8.06.02.0 4.0
017aaa101
0.2
0.1
0.3
0.4
R
Dson
(Ω)
0.0
(1)
(2)
NX2301P All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 26 October 2010 8 of 16
NXP Semiconductors
NX2301P
20 V, 2 A P-channel Trench MOSFET
V
DS
>I
D
× R
DSon
(1) T
amb
= 150 °C
(2) T
amb
=25°C
Fig 10. Transfer characteristics: drain current as a
function of gate-source voltage; typical values
Fig 11. Normalized drain-source on-state resistance
as a function of ambient temperature; typical
values
I
D
= 0.25 mA; V
DS
=V
GS
(1) maximum values
(2) typical values
(3) minimum values
f=1MHz; V
GS
=0V
(1) C
iss
(2) C
oss
(3) C
rss
Fig 12. Gate-source threshold voltage as a function of
ambient temperature
Fig 13. Input, output and reverse transfer
capacitances as a function of drain-source
voltage; typical values
017aaa102
V
GS
(V)
0.0 3.02.01.0
1.0
0.5
1.5
2.0
I
D
(A)
0.0
(1) (2)
T
amb
(°C)
60 180120060
017aaa103
1.0
0.5
1.5
2.0
a
0.0
a
R
DSon
R
DSon 25° C()
-----------------------------
=
T
amb
(°C)
60 180120060
017aaa104
0.5
1.0
1.5
V
GS(th)
(V)
0.0
(2)
(1)
(3)
017aaa105
V
DS
(V)
10
1
10
2
101
10
2
10
3
C
(pF)
10
(2)
(1)
(3)

NX2301P,215

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET P-CH -20 V -2 A
Lifecycle:
New from this manufacturer.
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