AD823 Data Sheet
Rev. E | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
Supply Voltage 36 V
Internal Power Dissipation
PDIP (N) 1.3 W
SOIC (R) 0.9 W
Input Voltage (Common Mode) ±V
S
Differential Input Voltage ±V
S
Output Short-Circuit Duration See Figure 4
Storage Temperature Range N, R
Operating Temperature Range −40°C to +85°C
Lead Temperature Range
(Soldering, 10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Specification is for device in free air.
Table 5. Thermal Resistance
JA
8-Lead PDIP 90 °C/W
MAXIMUM POWER DISSIPATION (W)
AMBIENT TEMPERATURE (°C)
2.0
1.5
0
–50 90–40 –30 –20 –10 0 10 20 30 50 60 70 8040
1.0
0.5
8-LEAD PDIP
8-LEAD SOIC
T
J
= 150°C
00901-004
Figure 4. Maximum Power Dissipation vs. Temperature
ESD CAUTION
