LTC4352
10
4352fa
applicaTions inForMaTion
Figure 6. Inrush and Ideal Diode Control on a Hot Swap Card
LTC4352
PLUG-IN CARD
CONNECTORSBACKPLANE
Q2
Si7336ADP
Q1
Si7336ADP
TO LOAD
NC
4352 F06
V
IN
UV
CPO
OV
SOURCE GATE OUT
GND
12V
GND
105k
0.1µF
C
G
10k
R6
10Ω
R
G
5.11k
R2
R3
Z1
Z1: DIODES INC. SMAJ12A
Inrush Control
The LTC4352 can be used for inrush control in applications
where the input supply is hot-plugged. See Figure 6. The
CPO capacitor is omitted, since fast turn-on with stored
charge is not desired here. Undervoltage holds the gate
off till the short pin makes contact. 40µs after the UV level
is satisfied, the MOSFET gate ramps up due to the CPO
pull-up current. A RC network on the gate further slows
down the output dV/dt, while allowing fast turn-off during
reverse current or overvoltage conditions. Resistor R
G
prevents high frequency oscillations in Q2. A dedicated
hot swap controller may be needed if overcurrent protec-
tion is also desired.
Undervoltage and Overvoltage Protection
Unlike a regular diode, the LTC4352 can prevent out of
range input voltages from affecting the load voltage. This
requires back-to-back MOSFETs, and resistive dividers
from the input to the UV and OV pins. For an example,
see Figure 5.
MOSFET Q2 is required to block conduction through the
body diode of Q1 when its gate is held off. The resistive
dividers set up the input voltage range where the ideal
diode control is allowed to operate. Outside this range,
the gate is held off and the FAULT pin pulls low.
When using a CPO capacitor in circuit with back-to-back
MOSFETs, there will be a large inrush current to the load
capacitance due to the fast gate turn-on after UV, OV levels
are met. Without the capacitor, the inrush will depend on
the CPO pull-up current charging up the gate capacitance.
Figure 5. 5V Ideal Diode with UV and OV Protection
UV
LTC4352
FAULT
STATUS
V
CC
31.6k
1%
1k
1%
3.09k
1%
C1
TO LOAD
5V
Q2
Si7336ADP
Q1
Si7336ADP
0.1µF
4352 F05
CPOV
IN
SOURCE GATE OUT
0.15µF
C2
REV
GND
R2
R1
R3
OV
LTC4352
11
4352fa
SOURCE
LTC4352
TO LOAD
5V
Q1
Si7336ADP
4352 F07
V
IN
GATE OUT
C2
0.1µF
R7
1k
GND
12V
CPO
Figure 7. 5V Ideal Diode with External 12V Powering CPO for
Faster Start-up and Refresh
applicaTions inForMaTion
External CPO Supply
The internal charge pump takes milliseconds to charge
up the CPO pin capacitor especially during device power
up. This time can be shortened by connecting an external
supply to the CPO pin. A series resistor is needed to limit
the current into the internal clamp between the CPO and
SOURCE pins. The CPO supply should also be higher than
the main input supply to meet the gate drive requirements
of the MOSFET. Figure 7 shows such a 5V ideal diode ap-
plication, where a 12V supply is connected to the CPO pin
through a 1k resistor. The 1k limits the current into the
CPO pin to 5.3mA, when the SOURCE pin is grounded.
Input Transient Protection
When the capacitances at the input and output are very
small, rapid changes in current can cause transients that
exceed the 24V Absolute Maximum Rating of the V
IN
and
OUT pins. In ORing applications using a single MOSFET, one
surge suppressor connected from OUT to ground clamps
all the inputs. In the absence of a surge suppressor, an
output capacitance of 10μF is sufficient in most applications
to prevent the transient from exceeding 24V. Back-to-back
MOSFET applications, depending on voltage levels, may
require a surge suppressor on each supply input.
Design Example
The following design example demonstrates the calcula-
tions involved for selecting components in a 12V system
with 10A maximum load current (see Figure 1).
First, calculate the R
DS(ON)
of the MOSFET to achieve the
desired forward drop at full load. Assuming a V
FWD
of
50mV (which is comfortably below the 200mV minimum
open MOSFET fault threshold):
R
DS ON
( )
V
FWD
I
LOAD
=
50mV
10A
= 5m
The Si7336ADP offers a good solution, in a SO-8 sized
package, with a maximum R
DS(ON)
of 4mΩ and BV
DSS
of
30V. The maximum power dissipation in the MOSFET is:
P = I
2
LOAD
• R
DS(ON)
= (10A)
2
• 4mΩ = 0.4W
With a maximum steady-state thermal resistance, θ
JA
,
of 65°C/W, 0.4W causes a modest 26°C rise in junction
temperature of the Si7336ADP above the ambient.
The input capacitance, C
ISS
, of the Si7336ADP is about
6500pF. Slightly exceeding the 10x recommendation, a
0.1µF capacitor is selected for C2.
LTC4352
12
4352fa
Figure 8. Recommended PCB Layout for Power MOSFET
1
2
3
4
5
6
12
11
10
9
8
7
C1
S
S
S
G
D
D
D
D
DRAWING IS NOT TO SCALE!
VIA TO GROUND PLANE
SOURCE
GATE
LTC4352 MSOP-12
GND
OUT
V
IN
V
CC
VIA TO GROUND PLANE
CURRENT FLOWCURRENT FLOW
W W
TRACK WIDTH W:
0.03˝ PER AMPERE
ON 1OZ CU FOIL
FROM INPUT
SUPPLY
TO LOAD
Q1
SO-8
4352 F08
applicaTions inForMaTion
LEDs, D1 and D2, require around 3mA for good luminous
intensity. Accounting for a 2V diode drop and 0.5V V
OL
,
R1 and R2 are set to 2.7k.
PCB Layout Considerations
Connect the V
IN
and OUT pin traces as close as possible
to the MOSFETs terminals. Keep the traces to the MOSFET
wide and short to minimize resistive losses. The PCB traces
associated with the power path through the MOSFET should
have low resistance. See Figure 8.
It is also important to put C1, the bypass capacitor for the
V
CC
pin, as close as possible between V
CC
and GND. Also
place C2 near the CPO and SOURCE pins. Surge suppres-
sors, when used, should be mounted close to the LTC4352
using short lead lengths.

LTC4352CDD#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Power Management Specialized - PMIC L V Ideal Diode Cntr w/ Mon ing
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union