19
AT91FR4081
1386CATARM02/02
Soldering
Profile
Table 7 gives the recommended soldering profile from J-STD-20.
Small packages may be subject to higher temperatures if they are reflowed in boards with
larger components. In this case, small packages may have to withstand temperatures of up to
235°C, not 220°C(IRreflow).
Recommended package reflow conditions depend on package thickness and volume. See
Table 8.
Notes: 1. The packages are qualified by Atmel by using IR reflow conditions, not convection or VPR.
2. By default, the package level 1 is qualified at 220°C (unless 235°C is stipulated).
3. The body temperature is the most important parameter but other profile parameters such as
total exposure time to hot temperature or heating rate may also influence component
reliability.
A maximum of three reflow passes is allowed per component.
Table 7. Soldering Profile
Convection or
IR/Convection VPR
Average Ramp-up Rate (183°C to Peak) 3°C/sec. max. 10°C/sec.
Preheat Temperature 125°25°C 120 sec. max
Temperature Maintained Above 183°C 60sec.to150sec.
Time within 5°C of Actual Peak Temperature 10 sec. to 20 sec. 60 sec.
Peak Temperature Range 220 +5/-0°Cor
235 +5/-0°C
215 to 219°Cor
235 +5/-0°C
Ramp-down Rate 6°C/sec. 10°C/sec.
Time 25°C to Peak Temperature 6 min. max
Table 8. Recommended Package Reflow Conditions
(1,2,3)
Parameter Temperature
Convection 220 +5/-0°C
VPR 215 to 219°C
IR/Convection 220 +5/-0°C
20
AT91FR4081
1386CATARM02/02
Document Details
Title AT91FR4081 Datasheet
Literature Number 1386S
Revision History
Version A Publication Date: Sep-00
Version B Publication Date: Jul-01
Version C Publication Date: 29-Jan-02
Revisions Since Previous Version
Page: 10
Added information to section Internal Memories
Page: 17
Changed Table 3
Page:18
Added Table 5
Page:19
Added section Soldering Profile
Printed on recycled paper.
© Atmel Corporation 2002.
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whichisdetailedinAtmels Terms and Conditions located on the Companys web site. The Company assumes no responsibility for any errors
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not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted
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