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MPXV7007DPT1

P1-P3P4-P6P7-P9P10-P11
MPXV7007
Sensors
Freescale Semiconductor, Inc. 7
Pressure
PACKAGE DIMENSIONS
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
W
C
M
J
K
V
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 10.540.4250.415 10.79
B 10.540.4250.415 10.79
C 12.700.5200.500 13.21
D 0.960.0420.038 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
M 0˚ 7˚ 0˚ 7˚
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
V 0.245 0.255 6.22 6.48
W 0.115 0.125 2.92 3.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
S
D
8 PL
G
4
5
8
1
S
B
M
0.25 (0.010) AT
-A-
-B-
N
S
MPXV7007
Sensors
8 Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE O
SMALL OUTLINE PACKAGE
NOTES:
1.
2.
3.
4.
CONTROLLING DIMENSION: INCH.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
N
A
C
0.004 (0.1)
DETAIL G
SEATING
PLANE
8X
P
D
E
e/2
e
A
M
0.004 (0.1) BC
E1
A
B
A0.006 (0.15) B
C
8X b
2 PLACES 4 TIPS
1
4
8
5
F
MIN MAX MIN MAX
MILLIMETERSINCHES
0.370 0.390 9.39 9.91
0.002 0.010 0.05 0.25
0.038 0.042 0.96 1.07
0.465 0.485 11.81 12.32
0.680 0.700 17.27 17.78
0.465 0.485 11.81 12.32
0.270 0.290 6.86 7.37
0.160 0.180 4.06 4.57
0.009 0.011 0.23 0.28
0.110 0.130 2.79 3.30
0.100 BSC 2.54 BSC
0.240 0.260 6.10 6.60
0.115 0.135 2.92 3.43
0.040 0.060 1.02 1.52
0˚ 7˚ 0˚ 7˚
DIM
A
A1
b
D
E
E1
e
M
N
P
T
F
K
L
θ
K
M
T
∅
GAGE
PLANE
DETAIL G
L
A1
θ
.014 (0.35)
STYLE 1:
PIN 1. GND
2. +Vout
3. Vs
4. -Vout
5. N/C
6. N/C
7. N/C
8. N/C
STYLE 2:
PIN 1. N/C
2. Vs
3. GND
4. Vout
5. N/C
6. N/C
7. N/C
8. N/C
MPXV7007
Sensors
Freescale Semiconductor, Inc. 9
Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE
NOTES:
1.
2.
3.
4.
CONTROLLING DIMENSION: INCH.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
N
A
C
0.004 (0.1)
DETAIL G
SEATING
PLANE
8X
P
T
∅
D
E
e/2
e
A
M
0.004 (0.1) BC
E1
A
B
A0.008 (0.20) B
C
8X b
2 PLACES 4 TIPS
1
4
8
5
F
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.300 0.330 7.11 7.62
A1 0.002 0.010 0.05 0.25
b 0.038 0.042 0.96 1.07
D 0.465 0.485 11.81 12.32
E
E1 0.465 0.485 11.81 12.32
e
M 0.270 0.290 6.86 7.36
N 0.080 0.090 2.03 2.28
P 0.009 0.011 0.23 0.28
T 0.115 0.125 2.92 3.17
0.100 BSC 2.54 BSC
F 0.245 0.255 6.22 6.47
K 0.120 0.130 3.05 3.30
L 0.061 0.071 1.55 1.80
0˚ 7˚ 0˚ 7˚
θ
0.717 BSC 18.21 BSC
K
M
GAGE
PLANE
DETAIL G
L
A1
θ
.014 (0.35)
P1-P3P4-P6P7-P9P10-P11

MPXV7007DPT1

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Buy MPXV7007DPT1
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors SOP DUAL PORT
Lifecycle:
New from this manufacturer.
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