13
Application Information
Digital Current Sensing Circuit
Figure 17 shows a typical application circuit for motor control phase current sensing. By choosing the appropriate shunt
resistance, any range of current can be monitored, from less than 1 A to more than 100 A.
NON-
ISOLATED
5 V/3.3 V
FLOATING POSITIVE
SUPPLY
R
SENSE
V
IN
+
V
IN
V
DD1
GND1
MCLKIN
MDAT
V
DD2
GND2
C3
0.1 PF
ISOLATION
BARRIER
GATE
DRIVE
CIRCUIT
HV+
HV–
C1
0.1 PF
D1
5.1 V
C2
10 nF
MOTOR
R2 39 :
R1
+–
ACPL-796JGND1 GND2
C4
10 PF
C5
10 PF
Figure 17. Typical application circuit for motor phase current sensing.
Power Supplies and Bypassing
As shown in Figure 17, a  oating power supply (which in
many applications could be the same supply that is used
to drive the high-side power transistor) is regulated to 5
V using a simple zener diode (D1); the value of resistor
R1 should be chosen to supply su cient current from
the existing  oating supply. The voltage from the current
sensing resistor or shunt (R
SENSE
) is applied to the input of
the ACPL-796J through an RC anti-aliasing  lter (R2 and
C2). And  nally, a clock is connected to the ACPL-796J and
data are connected to the digital  lter. Although the appli-
cation circuit is relatively simple, a few recommendations
should be followed to ensure optimal performance.
The power supply for the isolated modulator is most
often obtained from the same supply used to power the
power transistor gate drive circuit. If a dedicated supply
is required, in many cases it is possible to add an addi-
tional winding on an existing transformer. Otherwise,
some sort of simple isolated supply can be used, such as
a line powered transformer or a high-frequency DC-DC
converter.
An inexpensive 78L05 three terminal regulator can also be
used to reduce the  oating supply voltage to 5 V. To help
attenuate high-frequency power supply noise or ripple, a
resistor or inductor can be used in series with the input of
the regulator to form a low-pass  lter with the regulator’s
input bypass capacitor.
As shown in Figure 17, 0.1 F bypass capacitors (C1 and
C3) should be located as close as possible to the input and
output power-supply pins of the isolated modulator. The
bypass capacitors are required because of the high-speed
digital nature of the signals inside the isolated modulator.
For better  ltering, an additional 10-μF capacitor can be
used. A 10 nF bypass capacitor (C2) is also recommended
at the input due to the switched-capacitor nature of the
input circuit. The input bypass capacitor also forms part of
the anti-aliasing  lter, which is recommended to prevent
high frequency noise from aliasing down to lower fre-
quencies and interfering with the input signal.
PC Board Layout
The design of the printed circuit board (PCB) should follow
good layout practices, such as keeping bypass capacitors
close to the supply pins, keeping output signals away from
input signals, the use of ground and power planes, etc. In
addition, the layout of the PCB can also a ect the isolation
transient immunity (CMR) of the isolated modulator, due
primarily to stray capacitive coupling between the input
and the output circuits. To obtain optimal CMR perfor-
mance, the layout of the PC board should minimize any
stray coupling by maintaining the maximum possible
distance between the input and output sides of the circuit
and ensuring that any ground or power plane on the PC
board does not pass directly below or extend much wider
than the body of the isolated modulator.
14
Shunt Resistors
The current-sensing shunt resistor should have low re-
sistance (to minimize power dissipation), low inductance
(to minimize di/dt induced voltage spikes which could
adversely a ect operation), and reasonable tolerance (to
maintain overall circuit accuracy). Choosing a particu-
lar value for the shunt is usually a compromise between
minimizing power dissipation and maximizing accuracy.
Smaller shunt resistances decrease power dissipation,
while larger shunt resistances can improve circuit accuracy
by utilizing the full input range of the isolated modulator.
The  rst step in selecting a shunt is determining how
much current the shunt will be sensing. The graph in
Figure 18 shows the RMS current in each phase of a three-
phase induction motor as a function of average motor
output power (in horsepower, hp) and motor drive supply
voltage. The maximum value of the shunt is determined
by the current being measured and the maximum rec-
ommended input voltage of the isolated modulator. The
maximum shunt resistance can be calculated by taking the
maximum recommended input voltage and dividing by
the peak current that the shunt should see during normal
operation. For example, if a motor will have a maximum
RMS current of 10 A and can experience up to 50%
overloads during normal operation, then the peak current
is 21.1 A (= 10 × 1.414 × 1.5). Assuming a maximum input
voltage of 200 mV, the maximum value of shunt resistance
in this case would be about 10 m.
Figure 18. Motor Output Horsepower vs. Motor Phase Current and Supply.
15
5
40
15 20 25 30
25
MOTOR PHASE CURRENT - A
rms
10
30
MOTOR OUTPUT POWER - HORSEPOWER
5350
0
440
380
220
120
10
20
35
The maximum average power dissipation in the shunt
can also be easily calculated by multiplying the shunt
resistance times the square of the maximum RMS current,
which is about 1 W in the previous example.
If the power dissipation in the shunt is too high, the resis-
tance of the shunt can be decreased below the maximum
value to decrease power dissipation. The minimum value
of the shunt is limited by precision and accuracy require-
ments of the design. As the shunt value is reduced, the
output voltage across the shunt is also reduced, which
means that the o set and noise, which are  xed, become
a larger percentage of the signal amplitude. The selected
value of the shunt will fall somewhere between the
minimum and maximum values, depending on the par-
ticular requirements of a speci c design.
When sensing currents large enough to cause signi -
cant heating of the shunt, the temperature coe cient
(tempco) of the shunt can introduce nonlinearity due to
the signal dependent temperature rise of the shunt. The
e ect increases as the shunt-to-ambient thermal resis-
tance increases. This e ect can be minimized either by
reducing the thermal resistance of the shunt or by using
a shunt with a lower tempco. Lowering the thermal resis-
tance can be accomplished by repositioning the shunt
on the PC board, by using larger PC board traces to carry
away more heat, or by using a heat sink.
For a two-terminal shunt, as the value of shunt resistance
decreases, the resistance of the leads becomes a signi -
cant percentage of the total shunt resistance. This has two
primary e ects on shunt accuracy. First, the e ective resis-
tance of the shunt can become dependent on factors such
as how long the leads are, how they are bent, how far they
are inserted into the board, and how far solder wicks up
the lead during assembly (these issues will be discussed
in more detail shortly). Second, the leads are typically
made from a material such as copper, which has a much
higher tempco than the material from which the resistive
element itself is made, resulting in a higher tempco for the
shunt overall. Both of these e ects are eliminated when a
four-terminal shunt is used. A four-terminal shunt has two
additional terminals that are Kelvin-connected directly
across the resistive element itself; these two terminals are
used to monitor the voltage across the resistive element
while the other two terminals are used to carry the load
current. Because of the Kelvin connection, any voltage
drops across the leads carrying the load current should
have no impact on the measured voltage.
Several four-terminal shunts from Isotek (Isabellenhütte)
suitable for sensing currents in motor drives up to 71 Arms
(71 hp or 53 kW) are shown in Table 11; the maximum
current and motor power range for each of the PBV series
shunts are indicated. For shunt resistances from 50 m
down to 10 m, the maximum current is limited by the
input voltage range of the isolated modulator. For the
5 m and 2 m shunts, a heat sink may be required due
to the increased power dissipation at higher currents.
15
Table 11. Isotek (Isabellenhütte) four-terminal shunt summary.
Shunt Resistor
Part Number
Shunt
Resistance Tol.
Maximum
RMS Current
Motor Power Range
120 V
AC
- 440 V
AC
m % A hp kW
PBV-R050-0.5 50 0.5 3 0.8 - 3 0.6 - 2
PBV-R020-0.5 20 0.5 7 2 - 7 0.6 - 2
PBV-R010-0.5 10 0.5 14 4 - 14 3 - 10
PBV-R005-0.5 5 0.5 25 [28] 7 - 25 [8 - 28] 5 - 19 [6 - 21]
PBV-R002-0.5 2 0.5 39 [71] 11 - 39 [19 - 71] 8 - 29 [14 - 53]
Note: Values in brackets are with a heatsink for the shunt.
When laying out a PC board for the shunts, a couple of
points should be kept in mind. The Kelvin connections to
the shunt should be brought together under the body
of the shunt and then run very close to each other to the
input of the isolated modulator; this minimizes the loop
area of the connection and reduces the possibility of stray
magnetic  elds from interfering with the measured signal.
If the shunt is not located on the same PC board as the
isolated modulator circuit, a tightly twisted pair of wires
can accomplish the same thing.
Also, multiple layers of the PC board can be used to increase
current carrying capacity. Numerous plated-through vias
should surround each non-Kelvin terminal of the shunt to
help distribute the current between the layers of the PC
board. The PC board should use 2 or 4 oz. copper for the
layers, resulting in a current carrying capacity in excess of
20 A. Making the current carrying traces on the PC board
fairly large can also improve the shunt’s power dissipa-
tion capability by acting as a heat sink. Liberal use of vias
where the load current enters and exits the PC board is
also recommended.
Shunt Connections
The recommended method for connecting the isolated
modulator to the shunt resistor is shown in Figure 17. V
IN
+
of the ACPL-796J is connected to the positive terminal of
the shunt resistor, while V
IN
– is shorted to GND1, with the
power-supply return path functioning as the sense line
to the negative terminal of the current shunt. This allows
a single pair of wires or PC board traces to connect the
isolated modulator circuit to the shunt resistor. By refer-
encing the input circuit to the negative side of the sense
resistor, any load current induced noise transients on the
shunt are seen as a common-mode signal and will not
interfere with the current-sense signal. This is important
because the large load currents  owing through the
motor drive, along with the parasitic inductances inherent
in the wiring of the circuit, can generate both noise
spikes and o sets that are relatively large compared
to the small voltages that are being measured across the
current shunt.
If the same power supply is used both for the gate
drive circuit and for the current sensing circuit, it is very
important that the connection from GND1 of the isolated
modulator to the sense resistor be the only return path
for supply current to the gate drive power supply in order
to eliminate potential ground loop problems. The only
direct connection between the isolated modulator circuit
and the gate drive circuit should be the positive power
supply line.
In some applications, however, supply currents  owing
through the power-supply return path may cause o set
or noise problems. In this case, better performance may
be obtained by connecting V
IN
+ and V
IN
– directly across
the shunt resistor with two conductors, and connecting
GND1 to the shunt resistor with a third conductor for the
power-supply return path, as shown in Figure 19. When
connected this way, both input pins should be bypassed.
To minimize electromagnetic interference of the sense
signal, all of the conductors (whether two or three are
used) connecting the isolated modulator to the sense
resistor should be either twisted pair wire or closely
spaced traces on a PC board.
The 39 resistor in series with the input lead (R2) forms
a low pass anti-aliasing  lter with the 10 nF input bypass
capacitor (C2) with a 400 kHz bandwidth. The resistor
performs another important function as well; it dampens
any ringing which might be present in the circuit formed
by the shunt, the input bypass capacitor, and the induc-
tance of wires or traces connecting the two. Undamped
ringing of the input circuit near the input sampling
frequency can alias into the baseband producing what
might appear to be noise at the output of the device.

ACPL-796J-000E

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
Optically Isolated Amplifiers 5MHz-20MHz,5000 Vrms Sigma-Delta Modulatr
Lifecycle:
New from this manufacturer.
Delivery:
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