VEML6070
www.vishay.com
Vishay Semiconductors
Rev. 1.7, 05-Dec-16
10
Document Number: 84277
For technical questions, contact: sensorstechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
APPLICATION CIRCUIT BLOCK REFERENCE
Fig. 13 - VEML6070 Application Circuit
Notes
•V
DD
range: 2.7 V to 5.5 V
• The pull-up voltage for I
2
C bus is referring to the I/O specification of baseband
RECOMMENDED INFRARED REFLOW
Soldering conditions are based on J-STD-020 C definition.
1. After opening the tape and reel, IR reflow process should be done
2. IR reflow profile conditions
3. Recommend Normal Solder Reflow is 235 °C to 255 °C
RECOMMENDED STORAGE AND REBAKING CONDITIONS
PARAMETER CONDITIONS MIN. MAX. UNIT
Storage temperature 5 50 °C
Relative humidity - 60 %
Open time Rebaking process should be done when aluminized envelope reopened - -
Total time From the date code on the aluminized envelope (unopened) - 6 months
Rebaking
Tape and reel: 60 °C - 22 h
Tube: 60 °C - 22 h
IR REFLOW PROFILE CONDITION
PARAMETER CONDITIONS TEMPERATURE TIME
Peak temperature 255 °C + 0 °C / - 5 °C (max.: 260 °C) 10 s
Preheat temperature range and timing 150 °C to 200 °C 60 s to 180 s
Timing within 5 °C to peak temperature - 10 s to 30 s
Timing maintained above temperature / time 217 °C 60 s to 150 s
Timing from 25 °C to peak temperature - 8 min (max.)
Ramp-up rate 3 °C/s (max.) -
Ramp-down rate 6 °C/s (max.) -
I
2
C Bus Data SDA
I
2
C Bus Clock SCL
GPIO (INT)
SDA (3)
SCL (5)
ACK (2)
GND (1)
V
DD
(6)
C2
C1
R4
100 nF10 μF
10R
2.7 V to 5.5 V
1.7 V to 5.5 V
R2R1
RSET (4)
R3
C1 and R4
are optional
for very
disturbed
supply
R5
270K
Host
Micro Controller
VEML6070
