NRVTS2H60ESFT3G

NRVTS2H60ESF, NRVTSM260EV2
www.onsemi.com
4
TYPICAL CHARACTERISTICS
Figure 7. Forward Power Dissipation
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
310
0
2
4
8
Figure 8. Thermal Characteristics
t, PULSE TIME (s)
10001000.010.0010.00010.000010.000001
0.1
1
10
100
P
F(AV)
, AVERAGE FORWARD
POWER DISSIPATION (W)
R(t) (°C/W)
2
6
Square Wave
DC
I
PK
/I
AV
= 10
I
PK
/I
AV
= 5
I
PK
/I
AV
= 20
1010.1
50% Duty Cycle
20%
10%
5%
2%
1%
Single Pulse
10
14
12
NRVTS2H60ESF, NRVTSM260EV2
www.onsemi.com
5
PACKAGE DIMENSIONS
SOD−123FL
CASE 498
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
D
E
b
A
A1
L
c
POLARITY INDICATOR
OPTIONAL AS NEEDED
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.90 0.95 0.98 0.035
INCHES
A1 0.00 0.05 0.10 0.000
b 0.70 0.90 1.10 0.028
c 0.10 0.15 0.20 0.004
D 1.50 1.65 1.80 0.059
E 2.50 2.70 2.90 0.098
L 0.55 0.75 0.95 0.022
0.037 0.039
0.002 0.004
0.035 0.043
0.006 0.008
0.065 0.071
0.106 0.114
0.030 0.037
NOM MAX
3.40 3.60 3.80 0.134 0.142 0.150
H
E
0° 8° 0° 8°
q
q
q
TOP VIEW
BOTTOM VIEW
SIDE VIEW
H
E
2X
2X
END VIEW
RECOMMENDED
DIMENSIONS: MILLIMETERS
1.25
2X
4.20
1.22
2X
12
NRVTS2H60ESF, NRVTSM260EV2
www.onsemi.com
6
PACKAGE DIMENSIONS
POWERMITE
CASE 457−04
ISSUE F
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 1.75 2.05 0.069 0.081
B 1.75 2.18 0.069 0.086
C 0.85 1.15 0.033 0.045
D 0.40 0.69 0.016 0.027
F 0.70 1.00 0.028 0.039
H -0.05 +0.10 -0.002 +0.004
J 0.10 0.25 0.004 0.010
K 3.60 3.90 0.142 0.154
L 0.50 0.80 0.020 0.031
R 1.20 1.50 0.047 0.059
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 (0.006) PER SIDE.
S
B
M
0.08 (0.003) C
S
T
−A−
−B−
S
J
K
−T−
H
L
J
C
D
S
B
M
0.08 (0.003) C
S
T
F
PIN 1
PIN 2
R
0.50 REF 0.019 REF
2.54
0.100
0.635
0.025
1.27
0.050
2.67
0.105
0.762
0.030
ǒ
mm
inches
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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NRVTS2H60ESFT3G

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Schottky Diodes & Rectifiers TRENCH SCHOTTKY RECTIFIER
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