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PC4H520NIP

P1-P3P4-P6P7-P9P10-P12
Sheet No.: D2-A02801EN
7
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
PC4H520NIP
10%
90%
Output
Input
Input
Output
R
L
V
CC
R
D
t
s
t
d
t
r
t
f
Please refer to the conditions in Fig.13
V
CE
Fig.14 Test Circuit for Response Time
0.01
0.1 1
1 000
10
1
100
10
Response time (µs)
t
d
t
s
t
f
t
r
Load resistance R
L
(kΩ)
V
CE
=2V
I
C
=20mA
T
a
=25˚C
Fig.13 Response Time vs. Load Resistance
Sheet No.: D2-A02801EN
■ Design Considerations
While operating at I
F
<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
● Recommended Foot Print (reference)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
8
1.5
1.27
0.8
6.3
(Unit : mm)
● Design guide
PC4H520NIP
Sheet No.: D2-A02801EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
9
1234
300
200
100
0
0
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC4H520NIP
P1-P3P4-P6P7-P9P10-P12

PC4H520NIP

Mfr. #:
Buy PC4H520NIP
Manufacturer:
Sharp Microelectronics
Description:
OPTOISOLATOR 2.5KV DARL 4SMD
Lifecycle:
New from this manufacturer.
Delivery:
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