NCV4269C
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15
PACKAGE DIMENSIONS
TSSOP−14 EP
CASE 948AW
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.07 mm MAX. AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER RADI-
US OF THE FOOT. MINIMUM SPACE BETWEEN PRO-
TRUSION AND ADJACENT LEAD IS 0.07.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 mm PER SIDE. DIMENSION D IS DETERMINED AT
DATUM H.
5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSIONS. INTERLEAD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.25 mm PER
SIDE. DIMENSION E1 IS DETERMINED AT DATUM H.
6. DATUMS A AND B ARE DETERMINED AT DATUM H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM
THE SEATING PLANE TO THE LOWEST POINT ON THE
PACKAGE BODY.
8. SECTION B−B TO BE DETERMINED AT 0.10 TO 0.25 mm
FROM THE LEAD TIP.
DIM MIN MAX
MILLIMETERS
A −−−− 1.20
b 0.19 0.30
c 0.09 0.20
A1 0.05 0.15
L 0.45 0.75
M 0 8
__
6.70
14X
0.42
14X
1.15
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E 6.40 BSC
L2 0.25 BSC
RECOMMENDED
3.06
3.40
SECTION B−B
c
c1
b
b1
A2 0.80 1.05
b1 0.19 0.25
c1 0.09 0.16
D 4.90 5.10
D2 3.09 3.62
E1 4.30 4.50
E2 2.69 3.22
0.65 BSCe
SEATING
PLANE
A2
M
L
DETAIL A
END VIEW
PIN 1
7
1
14 8
TOP VIEW
E1
SIDE VIEW
REFERENCE
0.20 C
NOTE 5
2X 14 TIPS
B
0.10 C
C
A
14X
c
DETAIL A
A1
B
B
E2
BOTTOM VIEW
D2
b
0.10
C
NOTE 3
B A
14X
0.05 C
D
NOTE 4
GAUGE
PLANE
C
NOTE 7
H
L2
E
e
BA
NOTE 6
NOTE 8
A
NOTE 6
SS
