NCV4269C
www.onsemi.com
9
TYPICAL THERMAL CHARACTERISTICS
SO−8 Std Package NCV4269C, 1.0 oz
SO−8 Std Package NCV4269C, 2.0 oz
TSSOP−14 EP Package NCV4269C, 1.0 oz
TSSOP−14 EP Package NCV4269C, 2.0 oz
SO−8 EP Package NCV4269C, 1.0 oz
SO−8 EP Package NCV4269C, 2.0 oz
SO−14 w/6 Thermal Leads NCV4269C, 1.0 oz
SO−14 w/6 Thermal Leads NCV4269C, 2.0 oz
Figure 19. Junction−to−Ambient Thermal Resistance (q
JA
) vs. Heat Spreader Area
Figure 20. R(t) vs. Pulse Time
q
JA
(°C/W)
COPPER HEAT−SPREADER AREA (mm
2
)
70
600400300200100 5000
180
160
140
120
100
80
60
40
20
0
Single Pulse (SO−8 Std Package) PCB = 150 mm
2
, 2.0 oz
Single Pulse (TSSOP−14 EP Package) PCB = 150 mm
2
, 2.0 oz
Single Pulse (SO−8 EP Package) PCB = 150 mm
2
, 2.0 oz
Single Pulse (SO−14 w/6 TL Package) PCB = 150 mm
2
, 2.0 oz
R(t) (°C/W)
PULSE TIME (s)
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 100
1000
100
10
1
0.1