LTC5543
13
5543f
APPLICATIONS INFORMATION
Transformer-Based Bandpass IF Matching
The IF output can be matched for IF frequencies as low
as 90MHz or as high as 500MHz using the bandpass IF
matching shown in Figure 1 and Figure 7. L1 and L2 resonate
with the internal IF output capacitance at the desired IF
frequency. The value of L1, L2 is calculated as follows:
L1, L2 = 1/[(2 π f
IF
)
2
• 2 • C
IF
]
where C
IF
is the internal IF capacitance (listed in Table 4).
Values of L1 and L2 are tabulated in Figure 1 for various
IF frequencies.
Table 4. IF Output Impedance vs Frequency
FREQUENCY (MHz)
DIFFERENTIAL OUTPUT
IMPEDANCE (R
IF
|| X
IF
(C
IF
))
90 348 || –j680 (2.6pF)
140 335 || –j455 (2.5pF)
190 324 || –j349 (2.4pF)
240 320 || –j276 (2.4pF)
300 315 || –j221 (2.4pF)
380 310 || –j182 (2.3pF)
456 302 || –j145 (2.4pF)
The typical performance of the LTC5543 using transformer-
based bandpass IF matching at 305MHz output frequency
is shown in Figure 9. The values of L1 and L2 are 56nH
as shown in Figure 1.
Discrete IF Balun Matching
For many applications, it is possible to replace the IF Tran-
sformer with the discrete IF Balun shown in Figure 10.
The values of L5, L6, C13 and C14 are calculated to realize a
180° phase shift at the desired IF frequency and provide a 50
single-ended output, using the equations listed below. Inductor
L7 is used to cancel the internal capacitance C
IF
and supplies
bias voltage to the IF pin. C15 is a DC blocking capacitor.
LL
RR
CC
RR
L
X
IF OUT
IF
IF IF OUT
IF
56
13 14
1
7
,
,
=
=
••
=
ω
ω
ω
||
IIF
These equations give a good starting point, but it is usually
necessary to adjust the component values after building
and testing the circuit. The fi nal solution can be achieved
with less iteration by considering the parasitics of L7 in
the above calculation.
The typical performance of the LTC5543 using a 456MHz
discrete IF Balun is shown in Figure 11. The actual
component values are:
L5, L6 = 36nH, L7 = 48nH and C13, C14 = 3.3pF
RF FREQUENCY (GHz)
2.5
19
IIP3 (dBm)
G
C
(dB)
25
23
21
27
4
10
8
6
12
2.7 4.12.9 3.1 3.3
5543 F09
3.5 3.7 3.9
V
CCIF
= 5.0V
V
CCIF
= 3.3V
IF = 305MHz
LOW-SIDE LO
IIP3
G
C
Figure 9. Conversion Gain and IIP3 vs RF Frequency Using
Transformer-Based IF Matching
IF
OUT
V
CCIF
V
CC
L7
L5
C13
C15
C14
L3 (OR SHORT)
16181920
IF
AMP
BIAS
102mA
4mA
IFGND
LTC5543
IFBIAS IF
IF
+
R1
(OPTION TO
REDUCE
DC POWER)
5543 F10
L6
Figure 10. IF Amplifi er Schematic with Discrete IF Balun
LTC5543
14
5543f
APPLICATIONS INFORMATION
Measured IF output return losses for transformer-based
bandpass IF matching (190MHz and 305MHz IF frequency)
and discrete Balun IF matching (456MHz IF frequency) are
plotted in Figure 12.
Figure 11. Conversion Gain and IIp3 vs RF Frequency Using a
456MHz Discrete IF Balun
RF FREQUENCY (GHz)
2.6
19
IIP3 (dBm)
G
C
(dB)
25
27
23
21
29
4
10
12
8
6
14
2.8 4.23 3.2 3.4
5543 F11
3.6 3.8 4
V
CCIF
= 5.0V
V
CCIF
= 3.3V
IF = 456MHz
LOW-SIDE LO
G
C
IIP3
Figure 12. IF Output Return Loss
IF FREQUENCY (MHz)
140
30
IF PORT RETURN LOSS (dB)
15
10
5
20
25
0
180 220 260 300
5543 F12
340 380 420 460 500 540
190MHz IF
305MHz IF
456MHz IF
(DISCRETE BALUN)
IF Amplifi er Bias
The IF amplifi er delivers excellent performance with
V
CCIF
= 3.3V, which allows the V
CC
and V
CCIF
supplies
to be common. With V
CCIF
increased to 5V, the RF input
P1dB increases by more than 3dB, at the expense of higher
power consumption. Mixer performance at 2500MHz is
shown in Table 5 with V
CCIF
= 3.3V and 5V. For the highest
conversion gain, high-Q wire-wound chip inductors are
recommended for L1 and L2, especially when using
V
CCIF
= 3.3V. Low-cost multilayer chip inductors may be
substituted, with a slight degradation in performance.
Table 5. Performance Comparison with V
CCIF
= 3.3V and 5V
(RF = 2500MHz, High-Side LO, IF = 190MHz)
V
CCIF
(V)
I
CCIF
(mA)
G
C
(dB)
P1dB
(dBm)
IIP3
(dBm)
NF
(dB)
3.3 102 8.4 10.9 24.5 10.2
5 105 8.4 13.9 24.5 10.3
The IFBIAS pin (pin 20) is available for reducing the DC
current consumption of the IF amplifi er, at the expense of
reduced performance. This pin should be left open-circuited
for optimum performance. The internal bias circuit produces
a 4mA reference for the IF amplifi er, which causes the
amplifi er to draw approximately 102mA. If resistor R1 is
connected to pin 20 as shown in Figure 7, a portion of the
reference current can be shunted to ground, resulting in
reduced IF amplifi er current. For example, R1 = 1k will
shunt away 1.5mA from pin 20 and the IF amplifi er current
will be reduced by 38% to approximately 62mA. The nominal,
open-circuit DC voltage at pin 20 is 2.1V. Table 6 lists RF
performance at 2500MHz versus IF amplifi er current.
Table 6. Mixer Performance with Reduced IF Amplifi er Current
(RF = 2500MHz, High-Side LO, IF = 190MHz, V
CC
= V
CCIF
= 3.3V)
R1
(kΩ)
I
CCIF
(mA)
G
C
(dB)
IIP3
(dBm)
P1dB
(dBm)
NF
(dB)
OPEN 102 8.4 24.5 10.9 10.2
4.7 90 8.3 24.1 11 10.1
2.2 81 8.1 23.5 11 10.2
1 62 7.7 21.6 11 10.2
(RF = 3500MHz, Low-Side LO, IF = 190MHz, V
CC
= V
CCIF
= 3.3V)
R1
(kΩ)
I
CCIF
(mA)
G
C
(dB)
IIP3
(dBm)
P1dB
(dBm)
NF
(dB)
OPEN 100 6.7 25.1 11.3 11.8
4.7 90 6.4 24.7 11.4 11.7
2.2 82 6.1 24.2 11.5 11.8
1 64 5.3 23.2 11.4 12.1
Shutdown Interface
Figure 13 shows a simplifi ed schematic of the SHDN pin
interface. To disable the chip, the SHDN voltage must be
higher than 3.0V. If the shutdown function is not required,
the SHDN pin should be connected directly to GND. The
voltage at the SHDN pin should never exceed the power
supply voltage (V
CC
) by more than 0.3V. If this should
occur, the supply current could be sourced through the
ESD diode, potentially damaging the IC.
LTC5543
15
5543f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UH Package
20-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1818 Rev Ø)
The SHDN pin must be pulled high or low. If left fl oating,
then the on/off state of the IC will be indeterminate. If a
three-state condition can exist at the SHDN pin, then a
pull-up or pull-down resistor must be used.
Supply Voltage Ramping
Fast ramping of the supply voltage can cause a current
glitch in the internal ESD protection circuits. Depending on
the supply inductance, this could result in a supply voltage
transient that exceeds the maximum rating. A supply voltage
ramp time of greater than 1ms is recommended.
APPLICATIONS INFORMATION
Figure 13. Shutdown Input Circuit
5.00 p 0.10
5.00 p 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
PIN 1
TOP MARK
(NOTE 6)
0.40 p 0.10
2019
1
2
BOTTOM VIEW—EXPOSED PAD
2.60 REF
2.70 p 0.10
0.75 p 0.05
R = 0.125
TYP
R = 0.05
TYP
0.25 p 0.05
0.65 BSC
0.200 REF
0.00 – 0.05
(UH20) QFN 0208 REV Ø
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 p0.05
0.25 p0.05
0.65 BSC
2.60 REF
2.70 p 0.05
4.10 p 0.05
5.50 p 0.05
PACKAGE
OUTLINE
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 s 45o
CHAMFER
2.70 p 0.10
2.70 p 0.05
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
LTC5543
5
SHDN
500
V
CC2
5543 F13
6

LTC5543IUH#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer 2.3GHz - 4.0GHz High Dynamic Range Downconverting Mixer
Lifecycle:
New from this manufacturer.
Delivery:
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