LTC6605-7
19
66057f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WXXX)
IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. APPLY SOLDER MASK TO AREAS THAT
ARE NOT SOLDERED
3. DRAWING IS NOT TO SCALE
0.40 ± 0.05
PIN #1 NOTCH
R0.30 TYP OR
0.25mm × 45°
CHAMFER
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.10
TYP
1
2212
11
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DJC) DFN 0605
6.00 ±0.10
(2 SIDES)
0.25 ± 0.05
0.889
0.889
0.50 BSC
5.35 ± 0.10
(2 SIDES)
R = 0.10
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
2.20 ±0.05
0.70 ±0.05
3.60 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
5.35 ± 0.05
(2 SIDES)
0.889
0.889
PACKAGE DESCRIPTION
DJC Package
22-Lead Plastic DFN (6mm × 3mm)
(Reference LTC DWG # 05-08-1714)
