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NCV8402ASTT1G
P1-P3
P4-P6
P7-P9
P10-P12
P13-P13
NCV8402, NCV8402A
www
.onsemi.com
10
TEST CIRCUITS AND W
A
VEFORMS
VDD
IDS
VIN
L
VDS
tp
Figure 24. Inductive Load Switching T
est Circuit
DUT
G
D
S
RG
+
−
0 V
5 V
T
av
VIN
IDS
VDS
T
p
V
DS(on)
I
pk
0
VDD
V
(BR)DSS
Figure 25. Inductive Load Switching W
aveforms
NCV8402, NCV8402A
www
.onsemi.com
11
T
able 1. ORDERING INFORMA
TION
Device
Package
Shipping
†
NCV8402STT1G
SOT−223
(Pb−Free)
1000 / T
ape & Reel
NCV8402ASTT1G
NCV8402STT3G
SOT−223
(Pb−Free)
4000 / T
ape & Reel
NCV8402ASTT3G
NCV8402AMNT2G
DFN6
(Pb−Free)
2000 / T
ape & Reel
NCV8402AMNWT1G
DFN6
(Pb−Free, Wettable Flank)
3000 / T
ape & Reel
†
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T
ape and Reel
Packaging
Specifications Brochure, BRD801
1/D.
P
ACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE N
STYLE 3:
PIN 1.
GA
TE
2.
DRAIN
3.
SOURCE
4.
DRAIN
A1
b1
D
E
b
e
e1
4
12
3
0.08 (0003)
A
L1
C
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2.
CONTROLLING DIMENSION: INCH.
1.5
0.059
ǒ
mm
inches
Ǔ
SCALE 6:1
3.8
0.15
2.0
0.079
6.3
0.248
2.3
0.091
2.3
0.091
2.0
0.079
SOLDERING FOOTPRINT
H
E
DIM
A
MIN
NOM
MAX
MIN
MILLIMETERS
1.50
1.63
1.75
0.060
INCHES
A1
0.02
0.06
0.10
0.001
b
0.60
0.75
0.89
0.024
b1
2.90
3.06
3.20
0.1
15
c
0.24
0.29
0.35
0.009
D
6.30
6.50
6.70
0.249
E
3.30
3.50
3.70
0.130
e
2.20
2.30
2.40
0.087
0.85
0.94
1.05
0.033
0.064
0.068
0.002
0.004
0.030
0.035
0.121
0.126
0.012
0.014
0.256
0.263
0.138
0.145
0.091
0.094
0.037
0.041
NOM
MAX
L1
1.50
1.75
2.00
0.060
6.70
7.00
7.30
0.264
0.069
0.078
0.276
0.287
H
E
−
−
e1
0
°
1
0
°
0
°
1
0
°
q
q
L
L
0.20
−−
−
−−
−
0.008
−−−
−−−
NCV8402, NCV8402A
www
.onsemi.com
12
P
ACKAGE DIMENSIONS
DFN6 3x3.3, 0.95 PITCH
CASE 506AX
ISSUE O
*For
additional information on our Pb−Free strategy and soldering
details, please download the
ON Semiconductor Soldering and
Mounting T
echniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PIN 1
REFERENCE
A
B
C
0.15
2X
2X
TOP
VIEW
D
E
C
0.15
NOTES:
1.
DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2.
CONTROLLING DIMENSION: MILLIMETERS.
3.
DIMENSION b APPLIES TO PLA
TED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 mm
FROM TERMINAL.
4.
COPLANARITY APPLIES TO THE EXPOSED P
AD
AS WELL AS THE TERMINALS.
E2
BOTTOM VIEW
b
0.10
6X
L
13
0.05
C
AB
C
D2
4X
e
L1
64
6X
6X
(A3)
C
C
0.08
6X
C
0.10
SIDE VIEW
A1
A
SEA
TING
PLANE
DIM
MIN
NOM
MAX
MILLIMETERS
A
0.80
−
−−
0.90
A1
0.00
−−−
0.05
A3
0.20 REF
b
0.30
−
−−
0.40
D
3.00 BSC
D2
1.90
−−−
2.10
E
3.30 BSC
E2
1.10
−
−−
1.30
e
0.95 BSC
K
0.20
−
−−
−−
−
L
0.40
−
−−
0.60
(NOTE 3)
K
L1
0.00
−−−
0.15
6X
0.83
2.15
1.35
1
0.50
0.95
PITCH
3.60
DIMENSIONS: MILLIMETERS
6X
P1-P3
P4-P6
P7-P9
P10-P12
P13-P13
NCV8402ASTT1G
Mfr. #:
Buy NCV8402ASTT1G
Manufacturer:
ON Semiconductor
Description:
MOSFET 42V 2.0A
Lifecycle:
New from this manufacturer.
Delivery:
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EMS
Payment:
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