N
O
TRE
CO
MMENDED F
O
RNEWDE
S
I
G
N
NOT RECOMMENDED FOR NEW DESIGN
4
RF Device Data
Freescale Semiconductor, Inc.
MMG3002NT1
50 OHM TYPICAL CHARACTERISTICS
27
42
5
V
CC
, COLLECTOR VOLTAGE (V)
Figure 8. Third Order Output Intercept Point
versus Collector Voltage
39
36
33
30
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
5.1 5.2 5.45.3
f = 900 MHz
100 kHz Tone Spacing
100-- 4 0 -- 2 0 0 2 0 4 0 6 0 8 0
35
41
T, TEMPERATURE (_C)
Figure 9. Third Order Output Intercept Point
versus Case Temperature
40
39
38
37
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
36
Figure 10. Third Order Intermodulation Distortion
versus Output Power
P
out
, OUTPUT POWER (dBm)
IMD, THIRD ORDER
INTERMODULATION DISTORTION (dBc)
215791113
-- 8 0
-- 3 0
-- 5 0
-- 6 0
-- 7 0
V
CC
=5.2Vdc
f = 900 MHz
100 kHz Tone Spacing
-- 4 0
15
150
10
2
10
5
120
Figure 11. MTTF versus Junction Temperature
10
3
125 130 135 140 145
T
J
, JUNCTION TEMPERATURE (C)
NOTE: The MTTF is calculated with V
CC
=5.2Vdc,I
CC
=110mA
MTTF (YEARS)
4
0
8
0
f, FREQUENCY (GHz)
Figure 12. Noise Figure versus Frequency
6
4
2
123
NF, NOISE FIGURE (dB)
0.5 1.5 2.5 3.5
19
-- 7 0
-- 2 0
9
P
out
, OUTPUT POWER (dBm)
Figure 13. Single--Carrier W--CDMA Adjacent
Channel Power Ratio versus Output Power
-- 3 0
-- 4 0
-- 5 0
-- 6 0
17151311
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
V
CC
=5.2Vdc,
f = 900 MHz
100 kHz Tone Spacing
8 Vdc Supply with 25 Ω Dropping Resistor
17 19
10
4
V
CC
=5.2Vdc
V
CC
= 5.2 Vdc, f = 2140 MHz
Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth
Input Signal PAR = 8.5 dB @ 0.01% Probability(CCDF)
N
O
TRE
CO
MMENDED F
O
RNEWDE
S
I
G
N
NOT RECOMMENDED FOR NEW DESIGN
MMG3002NT1
5
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 40--800 MHz
Figure 14. 50 Ohm Test Circuit Schematic
RF
OUTPUT
RF
INPUT
V
SUPPLY
C3 C4
Z1 Z2
C1
Z5
C2
R1
L1
V
CC
Z4Z3
DUT
Figure 15. S21, S11 and S22 versus Frequency
-- 4 0
30
0
f, FREQUENCY (MHz)
S22
200 400 600 800
20
10
0
-- 1 0
-- 2 0
-- 3 0
Figure 16. 50 Ohm Test Circuit Component Layout
C1
L1
C2
R1
C4
C3
Z1, Z5 0.347 x 0.058 Microstrip
Z2 0.575 x 0.058 Microstrip
Z3 0.172 x 0.058 Microstrip
Z4 0.403 x 0.058 Microstrip
PCB Getek Grade ML200C, 0.031,
r
=4.1
S21, S11, S22 (dB)
S21
S11
MMG30XX
Rev 2
V
CC
=5.2Vdc
Table 8. 50 Ohm Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1, C2 0.01 F Chip Capacitors C0603C103J5RAC Kemet
C3 0.1 F Chip Capacitor C0603C104J5RAC Kemet
C4 1 F Chip Capacitor C0603C105J5RAC Kemet
L1 470 nH Chip Inductor BK2125HM471--T Taiyo Yuden
R1
7.5 Ω Chip Resistor
RK73B2ATTE7R5J KOA Speer
Table 9. Supply Voltage versus R1 Values
Supply Voltage 6 7 8 9 10 11 12 V
R1 Value 7.3 16 25 35 44 53 62
Note: To provide V
CC
= 5.2 Vdc and I
CC
= 110 mA at the device.
N
O
TRE
CO
MMENDED F
O
RNEWDE
S
I
G
N
NOT RECOMMENDED FOR NEW DESIGN
6
RF Device Data
Freescale Semiconductor, Inc.
MMG3002NT1
50 OHM APPLICATION CIRCUIT: 800--3400 MHz
Figure 17. 50 Ohm Test Circuit Schematic
RF
OUTPUT
RF
INPUT
V
SUPPLY
C3
C4
Z1 Z2
C1
Z5
C2
R1
L1
V
CC
Z4Z3
DUT
Figure 18. S21, S11 and S22 versus Frequency
-- 3 0
30
f, FREQUENCY (MHz)
S22
1200
20
10
0
-- 1 0
-- 2 0
Figure 19. 50 Ohm Test Circuit Component Layout
C1
L1
C2
R1
C4
C3
Z1, Z5 0.347 x 0.058 Microstrip
Z2 0.575 x 0.058 Microstrip
Z3 0.172 x 0.058 Microstrip
Z4 0.403 x 0.058 Microstrip
PCB Getek Grade ML200C, 0.031,
r
=4.1
S21, S11, S22 (dB)
S21
S11
1600800 2000 2400 2800 3200 3600
MMG30XX
Rev 2
V
CC
=5.2Vdc
Table 10. 50 Ohm Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1, C2 150 pF Chip Capacitors C0603C151J5RAC Kemet
C3 0.1 F Chip Capacitor C0603C104J5RAC Kemet
C4 1 F Chip Capacitor C0603C105J5RAC Kemet
L1 56 nH Chip Inductor HK160856NJ--T Taiyo Yuden
R1
7.5 Ω Chip Resistor
RK73B2ATTE7R5J KOA Speer

MMG3002NT1

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF Amplifier 21DBM 20 DB GEN PURP AMP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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