SI1403BDL-T1-GE3

Si1403BDL
www.vishay.com
Vishay Siliconix
S10-0110-Rev. D, 18-Jan-10
1
Document Number: 73253
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
P-Channel 2.5 V (G-S) MOSFET
Marking code: OD
FEATURES
TrenchFET
®
power MOSFET
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Note
a. Surface mounted on 1" x 1" FR4 board
PRODUCT SUMMARY
V
DS
(V) -20
R
DS(on)
max. () at V
GS
= -4.5 V 0.150
R
DS(on)
max. () at V
GS
= -3.6 V 0.175
R
DS(on)
max. () at V
GS
= -2.5 V 0.265
Q
g
typ. (nC) 2.9
I
D
(A) -1.5
Configuration Single
SOT-363
SC-70 Single (6 leads)
Top View
1
D
2
D
3
G
D
6
D
5
S
4
Available
ORDERING INFORMATION
Package SC-70
Lead (Pb)-free Si1403BDL-T1-E3
Lead (Pb)-free and halogen-free Si1403BDL-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL 5 s STEADY STATE UNIT
Drain-source voltage V
DS
-20 -20
V
Gate-source voltage V
GS
± 12 ± 12
Continuous drain current (T
J
= 150 °C)
a
T
A
= 25 °C
I
D
-1.5 -1.4
A
T
A
= 85 °C -1.2 -1.0
Pulsed drain current I
DM
-5 -5
Continuous diode current (diode conduction)
a
I
S
-0.8 -0.8
Maximum power dissipation
a
T
A
= 25 °C
P
D
0.625 0.568
W
T
A
= 85 °C 0.400 0.295
Operating junction and storage temperature range T
J
, T
stg
-55 to 150 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYPICAL MAXIMUM UNIT
Maximum junction-to-ambient
a
t 5 s
R
thJA
165 200
°C/WSteady state 180 220
Maximum junction-to-foot (drain) Steady state R
thJF
105 130
Si1403BDL
www.vishay.com
Vishay Siliconix
S10-0110-Rev. D, 18-Jan-10
2
Document Number: 73253
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics Transfer Characteristics
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Gate threshold voltage V
GS(th)
V
DS
= V
GS
, I
D
= -250 μA -0.6 - -1.3 V
Gate leakage I
GSS
V
DS
= 0 V, V
GS
= ± 12 V - - ± 100 nA
Zero gate voltage drain current I
DSS
V
DS
= -20 V, V
GS
= 0 V - - -1
μA
V
DS
= -20 V, V
GS
= 0 V, T
J
= 85 °C - - -5
On-state drain current
a
I
D(on)
V
DS
= -5 V, V
GS
= -4.5 V -2 - - A
Drain-source on-state resistance
a
R
DS(on)
V
GS
= -4.5 V, I
D
= -1.5 A - 0.120 0.150
V
GS
= -3.6 V, I
D
= -1.4 A - 0.140 0.175
V
GS
= -2.5 V, I
D
= -0.8 A - 0.220 0.265
Forward transconductance
a
g
fs
V
DS
= -10 V, I
D
= -1.5 A - 3.4 - S
Diode forward voltage
a
V
SD
I
S
= -0.8 A, V
GS
= 0 V - -0.8 -1.1 V
Dynamic
b
Total gate charge Q
g
V
DS
= -10 V, V
GS
= -4.5 V, I
D
= -1.5 A
-2.94.5
nCGate-source charge Q
gs
-0.65-
Gate-drain charge Q
gd
-1.0-
Gate resistance R
g
f = 1 MHz - 9 -
Turn-on delay time t
d(on)
V
DD
= -10 V, R
L
= 10 ,
I
D
-1 A, V
GEN
= -4.5 V, R
g
= 6
-1320
ns
Rise time t
r
-3045
Turn-off delay time t
d(off)
-2842
Fall time t
f
-1320
Source-drain reverse recovery time t
rr
I
F
= -0.8 A, dI/dt = 100 A/μs
-1225
Body diode reverse recovery charge Q
rr
-48nC
0.0
0.8
1.6
2.4
3.2
4.0
0.0 0.8 1.6 2.4 3.2 4.0
V
GS
= 5 V thru 2.5. V
2 V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
1 V, 0.5 V
1.5 V
0.0
0.8
1.6
2.4
3.2
4.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
T
C
= - 55 °C
125 °C
25 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
Si1403BDL
www.vishay.com
Vishay Siliconix
S10-0110-Rev. D, 18-Jan-10
3
Document Number: 73253
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
On-Resistance vs. Drain Current
Gate Charge
Source-Drain Diode Forward Voltage
Capacitance
On-Resistance vs. Junction Temperature
On-Resistance vs. Gate-to-Source Voltage
- On-Resistance ()R
DS(on)
0.00
0.08
0.16
0.24
0.32
0.40
01234
I
D
- Drain Current (A)
V
GS
= 3.6 V
V
GS
= 2.5 V
V
GS
= 4.5 V
0
1
2
3
4
5
0.0 0.5 1.0 1.5 2.0 2.5 3.0
V
DS
= 10 V
I
D
= 1.5 A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
0 0.3 0.6 0.9 1.2 1.5
T
J
= 150 °C
T
J
= 25 °C
10
1
0.1
V
SD
- Source-to-Drain Voltage (V)
- Source Current (A)I
S
0
100
200
300
400
500
048121620
V
DS
- Drain-to-Source Voltage (V)
C
rss
C
oss
C
iss
C - Capacitance (pF)
0.6
0.8
1.0
1.2
1.4
1.6
- 50 - 25 0 25 50 75 100 125 150
V
GS
= 4.5 V
I
D
= 1.5 A
T
J
- Junction Temperature (°C)
R
DS(on)
- On-Resistance
(Normalized)
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
012345
I
D
= 1.5 A
- On-Resistance (Ω)R
DS(on)
V
GS
- Gate-to-Source Voltage (V)
I
D
= 0.8 A

SI1403BDL-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET -20V Vds 12V Vgs SC-70
Lifecycle:
New from this manufacturer.
Delivery:
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