Outline Dimensions
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Vishay Semiconductors
Revision: 28-May-2018
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Document Number: 95536
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TO-247AD 2L
DIMENSIONS in millimeters and inches
Notes
(1)
Dimensioning and tolerancing per ASME Y14.5M-1994
(2)
Contour of slot optional
(3)
Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body
(4)
Thermal pad contour optional with dimensions D1 and E1
(5)
Lead finish uncontrolled in L1
(6)
Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7)
Outline conforms to JEDEC
®
outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4
SYMBOL
MILLIMETERS INCHES
NOTES SYMBOL
MILLIMETERS INCHES
NOTES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
A 4.65 5.31 0.183 0.209 E 15.29 15.87 0.602 0.625 3
A1 2.21 2.59 0.087 0.102 E1 13.46 - 0.53 -
A2 1.50 2.49 0.059 0.098 e 5.46 BSC 0.215 BSC
b 0.99 1.40 0.039 0.055 Ø K 0.254 0.010
b1 0.99 1.35 0.039 0.053 L 19.81 20.32 0.780 0.800
b2 1.65 2.39 0.065 0.094 L1 3.71 4.29 0.146 0.169
b3 1.65 2.34 0.065 0.092 Ø P 3.56 3.66 0.14 0.144
c 0.38 0.89 0.015 0.035 Ø P1 - 6.98 - 0.275
c1 0.38 0.84 0.015 0.033 Q 5.31 5.69 0.209 0.224
D 19.71 20.70 0.776 0.815 3 R 4.52 5.49 0.178 0.216
D1 13.08 - 0.515 - 4 S 5.51 BSC 0.217 BSC
D2 0.51 1.35 0.020 0.053
0.10 AC
M M
E
(2)
(3)
(4)
(4)
(2) R/2
B
2 x R
S
D
See view B
2 x e
2 x b
2 x b2
L
C
(5) L1
1, 2
3
Q
D
A
A2
A
A
A1
C
Ø K BD
M M
A
(6)
F P
(Datum B)
F P1
D1 (4)
4
E1
0.01 BD
M M
View A - A
Thermal pad
D2
DD
C
C
View B
(b1, b3)
Base metal
c1
(b, b2)
Section C - C, D - D
(c)
Plating