LPS331AP Mechanical and electrical specifications
Doc ID 022112 Rev 7 7/36
2.3 Absolute maximum ratings
Stress above those listed as “Absolute maximum ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Note: Supply voltage on any pin should never exceed 4.8 V.
Table 6. Absolute maximum ratings
Symbol Ratings Maximum value Unit
Vdd Supply voltage -0.3 to 4.8 V
Vdd_IO I/O pins supply voltage -0.3 to 4.8 V
Vin Input voltage on any control pin -0.3 to Vdd_IO +0.3 V
P Overpressure 20 bar
T
STG
Storage temperature range -40 to +125 °C
ESD Electrostatic discharge protection 2 (HBM) kV
This is a mechanical shock sensitive device, improper handling can cause permanent
damage to the part.
This is an ESD sensitive device, improper handling can cause permanent damage to
the part.
Functionality LPS331AP
8/36 Doc ID 022112 Rev 7
3 Functionality
The LPS331AP is a high resolution, digital output pressure sensor packaged in an HCLGA
holed package. The complete device includes a sensing element based on a piezoresistive
Wheatstone bridge approach, and an IC interface able to take the information from the
sensing element to the external world, as a digital signal.
3.1 Sensing element
An ST proprietary process is used to obtain a mono-silicon µ-sized membrane for MEMS
pressure sensors, without requiring substrate to substrate bonding. When pressure is
applied, the membrane deflection induces an imbalance in the Wheatstone bridge
piezoresistances, whose output signal is converted by the IC interface.
Intrinsic mechanical stoppers prevent breakage in case of pressure overstress, ensuring
measurement repeatability.
The pressure inside the buried cavity under the membrane is constant and controlled by
process parameters.
3.2 IC interface
The complete measurement chain consists of a low-noise capacitive amplifier, which
converts the resistive unbalance of the MEMS sensor into an analog voltage signal, and of
an analog-to-digital converter, which translates the produced signal into a digital bitstream.
The converter is coupled with a dedicated reconstruction filter which removes the high
frequency components of the quantization noise and provides low rate and high resolution
digital words.
The pressure data can be accessed through an I
2
C/SPI interface making the device
particularly suitable for direct interfacing with a microcontroller.
3.3 Factory calibration
The IC interface is factory calibrated at three temperatures and two pressures for sensitivity
and accuracy.
The trimming values are stored inside the device by a non-volatile structure. Whenever the
device is turned on, the trimming parameters are downloaded into the registers to be
employed during normal operation. This allows the user to employ the device without
requiring any further calibration.
LPS331AP Application hints
Doc ID 022112 Rev 7 9/36
4 Application hints
Figure 3. LPS331AP electrical connection
The device core is supplied through the Vdd line. Power supply decoupling capacitors (100
nF ceramic, 10 µF aluminum) should be placed as near as possible to the supply pad of the
device (common design practice).
The functionality of the device and the measured data outputs are selectable and accessible
through the I
2
C/SPI interface. When using the I
2
C, CS must be tied high (i.e. connected to
Vdd_IO).
4.1 Soldering information
The HCLGA package is compliant with the ECOPACK
®
standard and it is qualified for
soldering heat resistance according to JEDEC J-STD-020.
CS
10µ
Vdd
100nF
GND
Vdd_IO
SDO/SA0
SDA/SDI/SDO
Res
SCL/SPC
Digital signal from/to signal controller. Signal levels are defined through proper selection of Vdd_
1
5
8
13
TOP VIEW
6
9
1416
9
5
Res

LPS331APY

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Board Mount Pressure Sensors MEMS 260 -1260 mbar 0.020 RMS 5.5uA 30uA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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