4
FN9157.6
September 11, 2015
Absolute Maximum Ratings Thermal Information
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V
Supply Voltage (PVCC) . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.3V
BOOT Voltage (V
BOOT
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36V
Input Voltage (V
PWM
) . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 7V
UGATE. . . . . . . . . . . . . . . . . . . V
PHASE
- 0.3V
DC
to V
BOOT
+ 0.3V
V
PHASE
- 3.5V (<100ns Pulse Width, 2µJ) to V
BOOT
+ 0.3V
LGATE . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V
DC
to V
PVCC
+ 0.3V
GND - 5V (<100ns Pulse Width, 2µJ) to V
PVCC
+ 0.3V
PHASE. . . . . . . . . . . . . . . GND - 0.3V
DC
to 15V
DC
(V
PVCC
= 12V)
GND - 8V (<400ns, 20µJ) to 30V (<200ns, VBOOT - GND < 36V)
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . Class I JEDEC STD
Thermal Resistance
JA
(°C/W)
JC
(°C/W)
SOIC Package (Note 1) . . . . . . . . . . . . 100 N/A
DFN Package (Notes 2, 3) . . . . . . . . . . 48 7
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . . 0°C to +85°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12V ±10%
Supply Voltage Range, PVCC . . . . . . . . . . . . . . . . 5V to 12V ±10%
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air.
2.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted.
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
VCC SUPPLY CURRENT
Bias Supply Current I
VCC
ISL6594A, f
PWM
= 300kHz, V
VCC
= 12V - 8 - mA
ISL6594B, f
PWM
= 300kHz, V
VCC
= 12V - 4.5 - mA
I
VCC
ISL6594A, f
PWM
= 1MHz, V
VCC
= 12V - 10.5 - mA
ISL6594B, f
PWM
= 1MHz, V
VCC
= 12V - 5 - mA
Gate Drive Bias Current I
PVCC
ISL6594A, f
PWM
= 300kHz, V
PVCC
= 12V - 4 - mA
ISL6594B, f
PWM
= 300kHz, V
PVCC
= 12V - 7.5 - mA
I
PVCC
(Note 4)
ISL6594A, f
PWM
= 1MHz, V
PVCC
= 12V - 5 - mA
ISL6594B, f
PWM
= 1MHz, V
PVCC
= 12V - 8.5 - mA
POWER-ON RESET AND ENABLE
VCC Rising Threshold 9.35 9.8 10.0 V
VCC Falling Threshold 7.35 7.6 8.0 V
PWM INPUT (See Timing Diagram on page 6)
Input Current I
PWM
V
PWM
= 3.3V - 505 - µA
V
PWM
= 0V - -460 - µA
PWM Rising Threshold (Note 4) V
CC
= 12V - 1.70 - V
PWM Falling Threshold (Note 4) V
CC
= 12V - 1.30 - V
Typical Three-State Shutdown Window V
CC
= 12V 1.23 - 1.82 V
Three-State Lower Gate Falling Threshold V
CC
= 12V - 1.18 - V
Three-State Lower Gate Rising Threshold V
CC
= 12V - 0.76 - V
Three-State Upper Gate Rising Threshold V
CC
= 12V - 2.36 - V
Three-State Upper Gate Falling Threshold V
CC
= 12V - 1.96 - V
Shutdown Hold-off Time t
TSSHD
- 245 - ns
UGATE Rise Time t
RU
V
PVCC
= 12V, 3nF Load, 10% to 90% - 26 - ns
ISL6594A, ISL6594B
5
FN9157.6
September 11, 2015
LGATE Rise Time t
RL
V
PVCC
= 12V, 3nF Load, 10% to 90% - 18 - ns
UGATE Fall Time (Note 4) t
FU
V
PVCC
= 12V, 3nF Load, 90% to 10% - 18 - ns
LGATE Fall Time (Note 4) t
FL
V
PVCC
= 12V, 3nF Load, 90% to 10% - 12 - ns
UGATE Turn-On Propagation Delay (Note 4) t
PDHU
V
PVCC
= 12V, 3nF Load, Adaptive - 10 - ns
LGATE Turn-On Propagation Delay (Note 4) t
PDHL
V
PVCC
= 12V, 3nF Load, Adaptive - 10 - ns
UGATE Turn-Off Propagation Delay (Note 4) t
PDLU
V
PVCC
= 12V, 3nF Load - 10 - ns
LGATE Turn-Off Propagation Delay (Note 4) t
PDLL
V
PVCC
= 12V, 3nF Load - 10 - ns
LG/UG Three-State Propagation Delay (Note 4) t
PDTS
V
PVCC
= 12V, 3nF Load - 10 - ns
OUTPUT
Upper Drive Source Current (Note 4) I
U_SOURCE
V
PVCC
= 12V, 3nF Load - 1.25 - A
Upper Drive Source Impedance R
U_SOURCE
150mA Source Current 1.4 2.0 3.0
Upper Drive Sink Current (Note 4) I
U_SINK
V
PVCC
= 12V, 3nF Load - 2 - A
Upper Drive Sink Impedance R
U_SINK
150mA Sink Current 0.9 1.65 3.0
Lower Drive Source Current (Note 4) I
L_SOURCE
V
PVCC
= 12V, 3nF Load - 2 - A
Lower Drive Source Impedance R
L_SOURCE
150mA Source Current 0.85 1.3 2.2
Lower Drive Sink Current (Note 4) I
L_SINK
V
PVCC
= 12V, 3nF Load - 3 - A
Lower Drive Sink Impedance R
L_SINK
150mA Sink Current 0.60 0.94 1.35
NOTE:
4. Limits should be considered typical and are not production tested.
Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted. (Continued)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Functional Pin Description
PACKAGE PIN #
PIN
SYMBOL FUNCTIONSOIC DFN
1 1 UGATE Upper gate drive output. Connect to gate of high-side power N-Channel MOSFET.
2 2 BOOT Floating bootstrap supply pin for the upper gate drive. Connect the bootstrap capacitor between this pin and the
PHASE pin. The bootstrap capacitor provides the charge to turn on the upper MOSFET. See “Internal Bootstrap
Device” on page 7 for guidance in choosing the capacitor value.
- 3, 8 N/C No Connection.
3 4 PWM The PWM signal is the control input for the driver. The PWM signal can enter three distinct states during operation, see
“Three-State PWM Input” on page 6 for further details. Connect this pin to the PWM output of the controller.
4 5 GND Bias and reference ground. All signals are referenced to this node. It is also the power ground return of the driver.
5 6 LGATE Lower gate drive output. Connect to gate of the low-side power N-Channel MOSFET.
6 7 VCC Connect this pin to a +12V bias supply. Place a high quality low ESR ceramic capacitor from this pin to GND.
7 9 PVCC This pin supplies power to both upper and lower gate drives in ISL6594B; only the lower gate drive in ISL6594A.
Its operating range is +5V to 12V. Place a high quality low ESR ceramic capacitor from this pin to GND.
8 10 PHASE Connect this pin to the SOURCE of the upper MOSFET and the DRAIN of the lower MOSFET. This pin provides
a return path for the upper gate drive.
9 11 PAD Connect this pad to the power ground plane (GND) via thermally enhanced connection.
ISL6594A, ISL6594B
6
FN9157.6
September 11, 2015
Description
Operation
Designed for versatility and speed, the ISL6594A and
ISL6594B MOSFET drivers control both high-side and low-side
N-Channel FETs of a half-bridge power train from one
externally provided PWM signal.
Prior to VCC exceeding its POR level, the Pre-POR
overvoltage protection function is activated during initial
start-up; the upper gate (UGATE) is held low and the lower
gate (LGATE), controlled by the Pre-POR overvoltage
protection circuits, is connected to the PHASE. Once the
VCC voltage surpasses the VCC Rising Threshold (See
“Electrical Specifications” on page 4), the PWM signal takes
control of gate transitions. A rising edge on PWM initiates
the turn-off of the lower MOSFET (see “Timing Diagram” on
page 6). After a short propagation delay [t
PDLL
], the lower
gate begins to fall. Typical fall times [t
FL
] are provided in
“Electrical Specifications” on page 4. Adaptive shoot-through
circuitry monitors the LGATE voltage and determines the
upper gate delay time [t
PDHU
]. This prevents both the lower
and upper MOSFETs from conducting simultaneously. Once
this delay period is complete, the upper gate drive begins to
rise [t
RU
] and the upper MOSFET turns on.
A falling transition on PWM results in the turn-off of the upper
MOSFET and the turn-on of the lower MOSFET. A short
propagation delay [t
PDLU
] is encountered before the upper
gate begins to fall [t
FU
]. Again, the adaptive shoot-through
circuitry determines the lower gate delay time, t
PDHL
. The
PHASE voltage and the UGATE voltage are monitored, and
the lower gate is allowed to rise after PHASE drops below a
level or the voltage of UGATE to PHASE reaches a level
depending upon the current direction (See next section for
details). The lower gate then rises [t
RL
], turning on the lower
MOSFET.
Adaptive Zero Shoot-Through Deadtime Control
These drivers incorporate an adaptive deadtime control
technique to minimize deadtime, resulting in high efficiency
from the reduced freewheeling time of the lower MOSFETs’
body-diode conduction, and to prevent the upper and lower
MOSFETs from conducting simultaneously. This is
accomplished by ensuring either rising gate turns on its
MOSFET with minimum and sufficient delay after the other
has turned off.
During turn-off of the lower MOSFET, the LGATE voltage is
monitored until it drops below 1.75V, at which time the
UGATE is released to rise after 20ns of propagation delay.
Once the PHASE is high, the adaptive shoot-through
circuitry monitors the PHASE and UGATE voltages during a
PWM falling edge and the subsequent UGATE turn-off. If
either the UGATE falls to less than 1.75V above the PHASE
or the PHASE falls to less than +0.8V, the LGATE is
released to turn on.
Three-State PWM Input
A unique feature of these drivers and other Intersil drivers is
the addition of a shutdown window to the PWM input. If the
PWM signal enters and remains within the shutdown window
for a set hold off time, the driver outputs are disabled and
both MOSFET gates are pulled and held low. The shutdown
state is removed when the PWM signal moves outside the
shutdown window. Otherwise, the PWM rising and falling
thresholds outlined in the “Electrical Specifications” on
page 4 determine when the lower and upper gates are
enabled.
This feature helps prevent a negative transient on the output
voltage when the output is shut down, eliminating the
Schottky diode that is used in some systems for protecting
the load from reversed output voltage events.
PWM
UGATE
LGATE
t
FL
t
PDHU
t
PDLL
t
RL
t
TSSHD
t
PDTS
t
PDTS
1.18V < PWM < 2.36V
0.76V < PWM < 1.96V
t
FU
t
RU
t
PDLU
t
PDHL
t
TSSHD
FIGURE 1. TIMING DIAGRAM
ISL6594A, ISL6594B

ISL6594ACBZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers SYNCH BUCK FET DRVR 3 3V PWM FOR DIG MP
Lifecycle:
New from this manufacturer.
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