7
FN9157.6
September 11, 2015
In addition, more than 400mV hysteresis also incorporates
into the three-state shutdown window to eliminate PWM
input oscillations due to the capacitive load seen by the
PWM input through the body diode of the controller’s PWM
output when the power-up and/or power-down sequence of
bias supplies of the driver and PWM controller are required.
Power-On Reset (POR) Function
During initial start-up, the VCC voltage rise is monitored.
Once the rising VCC voltage exceeds 9.8V (typically),
operation of the driver is enabled and the PWM input signal
takes control of the gate drives. If VCC drops below the
falling threshold of 7.6V (typically), operation of the driver is
disabled.
Pre-POR Overvoltage Protection
For the ISL6594A, prior to VCC exceeding its POR level, the
upper gate is held low. For the ISL6594B, the upper gate
driver is powered from PVCC and will be held low when a
voltage of 2.75V or higher is present on PVCC as VCC
surpasses its POR threshold. For both devices, the lower
gate is controlled by the overvoltage protection circuits
during initial start-up. The PHASE is connected to the gate of
the low side MOSFET (LGATE), which provides some
protection to the microprocessor if the upper MOSFET(s) is
shorted during initial start-up. For complete protection, the
low side MOSFET should have a gate threshold well below
the maximum voltage rating of the load/microprocessor.
When VCC drops below its POR level, both gates pull low
and the Pre-POR overvoltage protection circuits are not
activated until VCC resets.
Internal Bootstrap Device
Both drivers feature an internal bootstrap Schottky diode.
Simply adding an external capacitor across the BOOT and
PHASE pins completes the bootstrap circuit. The bootstrap
function is also designed to prevent the bootstrap capacitor
from overcharging due to the large negative swing at the
trailing-edge of the PHASE node. This reduces voltage
stress on the boot to phase pins.
The bootstrap capacitor must have a maximum voltage
rating above UVCC + 5V and its capacitance value can be
chosen from Equation 1:
where Q
G1
is the amount of gate charge per upper MOSFET
at V
GS1
gate-source voltage and N
Q1
is the number of
control MOSFETs. The V
BOOT_CAP
term is defined as the
allowable droop in the rail of the upper gate drive.
As an example, suppose two IRLR7821 FETs are chosen as
the upper MOSFETs. The gate charge, Q
G
, from the data
sheet is 10nC at 4.5V (V
GS
) gate-source voltage. Then the
Q
GATE
is calculated to be 53nC for UVCC (i.e. PVCC in
ISL6594B, VCC in ISL6594A) = 12V. We will assume a
200mV droop in drive voltage over the PWM cycle. We find
that a bootstrap capacitance of at least 0.267F is required.
Gate Drive Voltage Versatility
The ISL6594A and ISL6594B provide the user flexibility in
choosing the gate drive voltage for efficiency optimization.
The ISL6594A upper gate drive is fixed to VCC [+12V], but
the lower drive rail can range from 12V down to 5V
depending on what voltage is applied to PVCC. The
ISL6594B ties the upper and lower drive rails together.
Simply applying a voltage from 5V up to 12V on PVCC sets
both gate drive rail voltages simultaneously.
Power Dissipation
Package power dissipation is mainly a function of the
switching frequency (f
SW
), the output drive impedance, the
external gate resistance, and the selected MOSFET’s
internal gate resistance and total gate charge. Calculating
the power dissipation in the driver for a desired application is
critical to ensure safe operation. Exceeding the maximum
allowable power dissipation level will push the IC beyond the
maximum recommended operating junction temperature of
+125°C. The maximum allowable IC power dissipation for
the SO8 package is approximately 800mW at room
temperature, while the power dissipation capacity in the DFN
package with an exposed heat escape pad is more than
1.5W. The DFN package is more suitable for high frequency
applications. See “Layout Considerations” on page 8 for
thermal transfer improvement suggestions. When designing
the driver into an application, it is recommended that the
following calculation is used to ensure safe operation at the
C
BOOT_CAP
Q
GATE
V
BOOT_CAP
--------------------------------------
Q
GATE
Q
G1
UVCC
V
GS1
------------------------------------
N
Q1
=
(EQ. 1)
50nC
20nC
FIGURE 2. BOOTSTRAP CAPACITANCE vs BOOT RIPPLE
VOLTAGE
V
BOOT_CAP
(V)
C
BOOT_CAP
(µF)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.30.0 0.1 0.2 0.4 0.5 0.6 0.90.7 0.8 1.0
Q
GATE
= 100nC
ISL6594A, ISL6594B
8
FN9157.6
September 11, 2015
desired frequency for the selected MOSFETs. The total gate
drive power losses due to the gate charge of MOSFETs and
the driver’s internal circuitry and their corresponding average
driver current can be estimated with Equations 2 and 3,
respectively:
where the gate charge (Q
G1
and Q
G2
) is defined at a
particular gate to source voltage (V
GS1
and V
GS2
) in the
corresponding MOSFET datasheet; I
Q
is the driver’s total
quiescent current with no load at both drive outputs; N
Q1
and N
Q2
are number of upper and lower MOSFETs,
respectively; UVCC and LVCC are the drive voltages for
both upper and lower FETs, respectively. The I
Q*
VCC
product is the quiescent power of the driver without
capacitive load and is typically 116mW at 300kHz.
The total gate drive power losses are dissipated among the
resistive components along the transition path. The drive
resistance dissipates a portion of the total gate drive power
losses, the rest will be dissipated by the external gate
resistors (R
G1
and R
G2
) and the internal gate resistors
(R
GI1
and R
GI2
) of MOSFETs. Figures 3 and 4 show the
typical upper and lower gate drives turn-on transition path.
The power dissipation on the driver can be roughly
estimated as shown in Equation 4:
Layout Considerations
For heat spreading, place copper underneath the IC whether
it has an exposed pad or not. The copper area can be
extended beyond the bottom area of the IC and/or
connected to buried copper plane(s) with thermal vias. This
combination of vias for vertical heat escape, extended
copper plane, and buried planes for heat spreading allows
the IC to achieve its full thermal potential.
Place each channel power component as close to each
other as possible to reduce PCB copper losses and PCB
parasitics: shortest distance between DRAINs of upper FETs
and SOURCEs of lower FETs; shortest distance between
DRAINs of lower FETs and the power ground. Thus, smaller
amplitudes of positive and negative ringing are on the
switching edges of the PHASE node. However, some space
in between the power components is required for good
airflow. The traces from the drivers to the FETs should be
kept short and wide to reduce the inductance of the traces
and to promote clean drive signals.
P
Qg_TOT
P
Qg_Q1
P
Qg_Q2
I
Q
VCC++=
(EQ. 2)
P
Qg_Q1
Q
G1
UVCC
2
V
GS1
---------------------------------------
f
SW
N
Q1
=
P
Qg_Q2
Q
G2
LVCC
2
V
GS2
--------------------------------------
f
SW
N
Q2
=
I
DR
Q
G1
UVCC N
Q1
V
GS1
------------------------------------------------------
Q
G2
LVCC N
Q2
V
GS2
-----------------------------------------------------
+



f
SW
I
Q
+=
(EQ. 3)
P
DR
P
DR_UP
P
DR_LOW
I
Q
VCC++=
(EQ. 4)
P
DR_UP
R
HI1
R
HI1
R
EXT1
+
--------------------------------------
R
LO1
R
LO1
R
EXT1
+
----------------------------------------
+



P
Qg_Q1
2
---------------------
=
P
DR_LOW
R
HI2
R
HI2
R
EXT2
+
--------------------------------------
R
LO2
R
LO2
R
EXT2
+
----------------------------------------
+



P
Qg_Q2
2
---------------------
=
R
EXT1
R
G1
R
GI1
N
Q1
-------------
+=
R
EXT2
R
G2
R
GI2
N
Q2
-------------
+=
FIGURE 3. TYPICAL UPPER-GATE DRIVE TURN-ON PATH
FIGURE 4. TYPICAL LOWER-GATE DRIVE TURN-ON PATH
Q1
D
S
G
R
GI1
R
G1
BOOT
R
HI1
C
DS
C
GS
C
GD
R
LO1
PHASE
UVCC
LVCC
Q2
D
S
G
R
GI2
R
G2
R
HI2
C
DS
C
GS
C
GD
R
LO2
ISL6594A, ISL6594B
9
FN9157.6
September 11, 2015
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com
.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support.
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make
sure that you have the latest revision.
DATE REVISION CHANGE
September 11, 2015 FN9157.6 Updated Ordering Information table on page 2.
Added Revision History and About Intersil sections.
Updated Package Outline Drawing L10.3x3 to the latest revision.
-Revision 3 to Revision 4 changes - Add Typical Recommended Land Pattern
-Revision 4 to Revision 5 changes - Converted to newer standard
-Revision 5 to Revision 6 changes - Changed Note 4 from "Dimension b applies..." to "Lead width
applies...", Changed Note callout in Detail X from 4 to 5, Changed height in side view from 0.90 MAX to 1.00
MAX, Added Note 4 callout next to lead width in Bottom View, In Land Pattern, corrected lead shape for 4
corner pins to "L" shape (was rectangular and did not match bottom view)
-Revision 6 to Revision 7 changes - Removed package outline and included center to center distance
between lands on recommended land pattern. Removed Note 4 "Dimension b applies to the metallized
terminal and is measured between 0.18mm and 0.30mm from the terminal tip." since it is not applicable to
this package. Renumbered notes accordingly.
-Revision 7 to Revision 8 changes - Corrected L-shaped leads in Bottom view and land pattern so that
they align with the rest of the leads (L shaped leads were shorter)
-Revision 8 to Revision 9 changes - Added missing dimension 0.415 in Typical Recommended land
pattern.
-Revision 9 to Revision 10 changes - Shortened the e-pad rectangle on both the recommended land
pattern and the package bottom view to line up with the centers of the corner pins.
-Revision 10 to Revision 11 changes - Tiebar Note 4 updated
From: Tiebar shown (if present) is a non-functional feature.
To: Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends).
ISL6594A, ISL6594B

ISL6594ACBZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers SYNCH BUCK FET DRVR 3 3V PWM FOR DIG MP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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