APT60M80L2VRG

MAXIMUM RATINGS All Ratings: T
C
= 25°C unless otherwise specified.
APT60M80L2VR
600V 65A 0.080
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
G
D
S
050-5991 Rev B 6-2004
Power MOS V
®
is a new generation of high voltage N-Channel enhancement
mode power MOSFETs. This new technology minimizes the JFET effect,
increases packing density and reduces the on-resistance. Power MOS V
®
also achieves faster switching speeds through optimized gate layout.
• TO-264 MAX Package Avalanche Energy Rated
Faster Switching
Lower Leakage
TO-264
Max
L2VR
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
T
J
,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
C
= 25°C
Pulsed Drain Current
1
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
Total Power Dissipation @ T
C
= 25°C
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
Avalanche Current
1
(Repetitive and Non-Repetitive)
Repetitive Avalanche Energy
1
Single Pulse Avalanche Energy
4
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
APT60M80L2VR
600
65
260
±30
±40
833
6.67
-55 to 150
300
65
50
3200
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
GS
= 0V, I
D
= 250µA)
Drain-Source On-State Resistance
2
(V
GS
= 10V, I
D
= 32.5A)
Zero Gate Voltage Drain Current (V
DS
= 600V, V
GS
= 0V)
Zero Gate Voltage Drain Current (V
DS
= 480V, V
GS
= 0V, T
C
= 125°C)
Gate-Source Leakage Current (V
GS
= ±30V, V
DS
= 0V)
Gate Threshold Voltage (V
DS
= V
GS
, I
D
= 5mA)
Symbol
BV
DSS
R
DS(on)
I
DSS
I
GSS
V
GS(th)
UNIT
Volts
Ohms
µA
nA
Volts
MIN TYP MAX
600
0.080
25
250
±100
24
POWER MOS V
®
MOSFET
DYNAMIC CHARACTERISTICS APT60M80L2VR
050-5991 Rev B 6-2004
Symbol
R
θJC
R
θJA
MIN TYP MAX
0.15
40
UNIT
°C/W
Characteristic
Junction to Case
Junction to Ambient
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
on
E
off
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Turn-on Switching Energy
6
Turn-off Switching Energy
Turn-on Switching Energy
6
Turn-off Switching Energy
Test Conditions
V
GS
= 0V
V
DS
= 25V
f
= 1 MHz
V
GS
= 10V
V
DD
= 300V
I
D
= 65A @ 25°C
RESISTIVE SWITCHING
V
GS
= 15V
V
DD
= 300V
I
D
= 65A @ 25°C
R
G
= 0.6
INDUCTIVE SWITCHING @ 25°C
V
DD
= 400V, V
GS
= 15V
I
D
= 65A, R
G
= 5
INDUCTIVE SWITCHING @ 125°C
V
DD
= 400V, V
GS
= 15V
I
D
= 65A, R
G
= 5
MIN TYP MAX
13300
1610
700
590
50
310
14
24
70
31
1880
2830
3100
3345
UNIT
pF
nC
ns
µ
J
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
THERMAL CHARACTERISTICS
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
Pulsed Source Current
1
(Body Diode)
Diode Forward Voltage
2
(V
GS
= 0V, I
S
= -I
D
65A)
Reverse Recovery Time (I
S
= -I
D
65A, dl
S
/dt = 100A/µs)
Reverse Recovery Charge (I
S
= -I
D
65A, dl
S
/dt = 100A/µs)
Peak Diode Recovery
dv
/
dt
5
UNIT
Amps
Volts
ns
µC
V/ns
MIN TYP MAX
65
260
1.3
937
29
8
Symbol
I
S
I
SM
V
SD
t
rr
Q
rr
dv
/
dt
1 Repetitive Rating: Pulse width limited by maximum junction
temperature
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
3 See MIL-STD-750 Method 3471
4 Starting T
j
=
+25°C, L = 1.51mH, R
G
=
25, Peak I
L
= 65A
5
dv
/
dt
numbers reflect the limitations of the test circuit rather than the
device itself. I
S
-I
D
65A
di
/
dt
700A/µs V
R
600V T
J
150°C
6 Eon includes diode reverse recovery. See figures 18, 20.
APT Reserves the right to change, without notice, the specifications and information contained herein.
Note:
Duty Factor D =
t
1
/
t
2
Peak T
J
= P
DM
x Z
θJC
+ T
C
t
1
t
2
P
DM
SINGLE PULSE
Z
θ
JC
, THERMAL IMPEDANCE (°C/W)
10
-5
10
-4
10
-3
10
-2
10
-1
1.0
RECTANGULAR PULSE DURATION (SECONDS)
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
0.5
0.1
0.3
0.7
0.9
0.05
050-5991 Rev B 6-2004
Typical Performance Curves
APT60M80L2VR
T
J
= +125°C
T
J
= +25°C
T
J
= -55°C
V
DS
> I
D
(ON) x R
DS
(ON)MAX.
250µSEC. PULSE TEST
@ <0.5 % DUTY CYCLE
15 &10V
6.5V
4.5V
4V
5V
5.5V
6V
R
DS
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
D
, DRAIN CURRENT (AMPERES) I
D
, DRAIN CURRENT (AMPERES)
(NORMALIZED)
V
GS
(TH), THRESHOLD VOLTAGE BV
DSS
, DRAIN-TO-SOURCE BREAKDOWN R
DS
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
D
, DRAIN CURRENT (AMPERES)
(NORMALIZED) VOLTAGE (NORMALIZED)
V
DS
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 2, TRANSIENT THERMAL IMPEDANCE MODEL FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS
V
GS
, GATE-TO-SOURCE VOLTAGE (VOLTS) I
D
, DRAIN CURRENT (AMPERES)
FIGURE 4, TRANSFER CHARACTERISTICS FIGURE 5, R
DS
(ON) vs DRAIN CURRENT
T
C
, CASE TEMPERATURE (°C) T
J
, JUNCTION TEMPERATURE (°C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
T
J
, JUNCTION TEMPERATURE (°C) T
C
, CASE TEMPERATURE (°C)
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
0.0456
0.104
0.0272F
0.493F
Power
(watts)
RC MODEL
Junction
temp. (°C)
Case temperature. (°C)
V
GS
=10V
V
GS
=20V
NORMALIZED TO
V
GS
= 10V @ I
D
= 32.5A
0 5 10 15 20 25 30
012345678 020406080100120140160
25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
180
160
140
120
100
80
60
40
20
0
1.4
1.3
1.2
1.1
1.0
0.9
0.8
1.15
1.10
1.05
1.00
0.95
0.90
1.2
1.1
1.0
0.9
0.8
0.7
0.6
I
D
= 32.5A
V
GS
= 10V
200
180
160
140
120
100
80
60
40
20
0
70
60
50
40
30
20
10
0
2.5
2.0
1.5
1.0
0.5
0.0

APT60M80L2VRG

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
Discrete Semiconductor Modules FG, MOSFET, 600V, TO-264 MAX, RoHS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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