IXFX220N17T2

© 2010 IXYS CORPORATION, All Rights Reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 175°C 170 V
V
DGR
T
J
= 25°C to 175°C, R
GS
= 1MΩ 170 V
V
GSS
Continuous ± 20 V
V
GSM
Transient ± 30 V
I
D25
T
C
= 25°C (Chip Capability) 220 A
I
L(RMS)
External Lead Current Limit 160 A
I
DM
T
C
= 25°C, Pulse Width Limited by T
JM
550 A
I
A
T
C
= 25°C 110 A
E
AS
T
C
= 25°C2J
P
D
T
C
= 25°C 1250 W
dv/dt I
S
I
DM
, V
DD
V
DSS
, T
J
175°C 20 V/ns
T
J
-55 ... +175 °C
T
JM
175 °C
T
stg
-55 ... +175 °C
T
L
1.6mm (0.062 in.) from Case for 10s 300 °C
T
SOLD
Plastic Body for 10s 260 °C
M
d
Mounting Torque (TO-264) 1.13/10 Nm/lb.in.
F
C
Mounting Force (PLUS247) 20..120 /4.5..27 N/lb.
Weight TO-264 10 g
PLUS247 6 g
Symbol Test Conditions Characteristic Values
(T
J
= 25°C Unless Otherwise Specified) Min. Typ. Max.
BV
DSS
V
GS
= 0V, I
D
= 3mA 170 V
V
GS(th)
V
DS
= V
GS
, I
D
= 8mA 2.5 5.0 V
I
GSS
V
GS
= ± 20V, V
DS
= 0V ± 200 nA
I
DSS
V
DS
= V
DSS
, V
GS
= 0V 25 μA
T
J
= 150°C 3 mA
R
DS(on)
V
GS
= 10V, I
D
= 60A, Note 1 5.1 6.3 mΩ
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
IXFK220N17T2
IXFX220N17T2
V
DSS
= 170V
I
D25
= 220A
R
DS(on)
6.3m
ΩΩ
ΩΩ
Ω
t
rr
140ns
DS100230(01/10)
Features
z
High Current Handling Capability
z
Fast Intrinsic Diode
z
Avalanche Rated
z
Low R
DS(on)
Advantages
z
Easy to Mount
z
Space Savings
z
High Power Density
Applications
z
Synchronous Recification
z
DC-DC Converters
z
Battery Chargers
z
Switch-Mode and Resonant-Mode
Power Supplies
z
DC Choppers
z
AC Motor Drives
z
Uninterruptible Power Supplies
z
High Speed Power Switching
Applications
GigaMOS
TM
TrenchT2
HiperFET
TM
Power MOSFET
Advance Technical Information
G = Gate D = Drain
S = Source Tab = Drain
PLUS247 (IXFX)
TO-264 (IXFK)
S
G
D
Tab
Tab
G
S
D
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXFK220N17T2
IXFX220N17T2
Symbol Test Conditions Characteristic Values
(T
J
= 25°C Unless Otherwise Specified) Min. Typ. Max.
g
fs
V
DS
= 10V, I
D
= 60A, Note 1 105 175 S
C
iss
31 nF
C
oss
V
GS
= 0V, V
DS
= 25V, f = 1MHz 2130 pF
C
rss
290 pF
R
Gi
Gate Input Resistance 1.40 Ω
t
d(on)
44 ns
t
r
160 ns
t
d(off)
40 ns
t
f
150 ns
Q
g(on)
500 nC
Q
gs
V
GS
= 10V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
130 nC
Q
gd
137 nC
R
thJC
0.12 °C/W
R
thCS
0.15 °C/W
Note 1. Pulse test, t 300μs, duty cycle, d 2%.
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
TO-264 (IXFK) Outline
Millimeter Inches
Min. Max. Min. Max.
A 4.82 5.13 .190 .202
A1 2.54 2.89 .100 .114
A2 2.00 2.10 .079 .083
b 1.12 1.42 .044 .056
b1 2.39 2.69 .094 .106
b2 2.90 3.09 .114 .122
c 0.53 0.83 .021 .033
D 25.91 26.16 1.020 1.030
E 19.81 19.96 .780 .786
e 5.46 BSC .215 BSC
J 0.00 0.25 .000 .010
K 0.00 0.25 .000 .010
L 20.32 20.83 .800 .820
L1 2.29 2.59 .090 .102
P 3.17 3.66 .125 .144
Q 6.07 6.27 .239 .247
Q1 8.38 8.69 .330 .342
R 3.81 4.32 .150 .170
R1 1.78 2.29 .070 .090
S 6.04 6.30 .238 .248
T 1.57 1.83 .062 .072
Dim.
PLUS 247
TM
(IXFX) Outline
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.83 5.21 .190 .205
A
1
2.29 2.54 .090 .100
A
2
1.91 2.16 .075 .085
b 1.14 1.40 .045 .055
b
1
1.91 2.13 .075 .084
b
2
2.92 3.12 .115 .123
C 0.61 0.80 .024 .031
D 20.80 21.34 .819 .840
E 15.75 16.13 .620 .635
e 5.45 BSC .215 BSC
L 19.81 20.32 .780 .800
L1 3.81 4.32 .150 .170
Q 5.59 6.20 .220 0.244
R 4.32 4.83 .170 .190
Source-Drain Diode
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, Unless Otherwise Specified) Min. Typ. Max.
I
S
V
GS
= 0V 220 A
I
SM
Repetitive, Pulse Width Limited by T
JM
880 A
V
SD
I
F
= 100A, V
GS
= 0V, Note 1 1.3 V
t
rr
140 ns
Q
RM
0.5 μC
I
RM
8.6 A
I
F
= 110A, -di/dt = 100A/μs
V
R
= 85V, V
GS
= 0V
Resistive Switching Times
V
GS
= 10V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
R
G
= 1Ω (External)
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a
"considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.
Terminals: 1 - Gate
2 - Drain
3 - Source
Terminals: 1 - Gate
2 - Drain
3 - Source
© 2010 IXYS CORPORATION, All Rights Reserved
IXFK220N17T2
IXFX220N17T2
Fig. 1. Output Characteristics @ T
J
= 25ºC
0
20
40
60
80
100
120
140
160
180
200
220
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
V
DS
- Volts
I
D
- Amperes
V
GS
= 10V
7V
4V
6V
5V
Fig. 3. Output Characteristics @ T
J
= 150ºC
0
20
40
60
80
100
120
140
160
180
200
220
0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2
V
DS
- Volts
I
D
- Amperes
V
GS
= 10V
7V
6V
5
V
4
V
Fig. 4. R
DS(on)
Normalized to I
D
= 110A Value
vs. Junction Temperature
0.2
0.6
1.0
1.4
1.8
2.2
2.6
3.0
3.4
-50 -25 0 25 50 75 100 125 150 175
T
J
- Degrees Centigrade
R
DS(on)
- Normalized
V
GS
= 10V
I
D
= 220A
I
D
= 110A
Fig. 5. Normalized R
DS(on)
I
D
= 110A Value
vs. Drain Current
0.6
1.0
1.4
1.8
2.2
2.6
3.0
3.4
0 40 80 120 160 200 240 280 320 360
I
D
- Amperes
R
DS(on)
- Normalized
V
GS
= 10V
T
J
= 175ºC
T
J
= 25ºC
Fig. 6. Drain Current vs. Case Temperature
0
20
40
60
80
100
120
140
160
180
-50 -25 0 25 50 75 100 125 150 175
T
C
- Degrees Centigrade
I
D
- Amperes
External Lead Current Limit
Fig. 2. Extended Output Characteristics @ T
J
= 25ºC
0
50
100
150
200
250
300
350
400
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
V
DS
- Volts
I
D
- Amperes
V
GS
= 10V
7V
5V
6V
4V

IXFX220N17T2

Mfr. #:
Manufacturer:
Littelfuse
Description:
MOSFET GigaMOS Trench T2 HiperFET Pwr MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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