MC74HC390ADR2G

© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 7
1 Publication Order Number:
MC74HC390A/D
MC74HC390A
Dual 4-Stage Binary Ripple
Counter with ÷ 2 and ÷ 5
Sections
High−Performance Silicon−Gate CMOS
The MC74HC390A is identical in pinout to the LS390. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
This device consists of two independent 4−bit counters, each
composed of a divide−by−two and a divide−by−five section. The
divide−by−two and divide−by−five counters have separate clock
inputs, and can be cascaded to implement various combinations of ÷ 2
and/or ÷ 5 up to a ÷ 100 counter.
Flip−flops internal to the counters are triggered by high−to−low
transitions of the clock input. A separate, asynchronous reset is
provided for each 4−bit counter. State changes of the Q outputs do not
occur simultaneously because of internal ripple delays. Therefore,
decoded output signals are subject to decoding spikes and should not
be used as clocks or strobes except when gated with the Clock of the
HC390A.
Features
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No 7 A
Chip Complexity: 244 FETs or 61 Equivalent Gates
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Q
A
Q
B
Q
C
Q
D
1, 15
4, 12
2, 14
3, 13
5, 11
6, 10
7, 9
PIN 16 = V
CC
PIN 8 = GND
CLOCK A
RESET
CLOCK B
÷ 2
COUNTER
÷ 5
COUNTER
Figure 1. Logic Diagram
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See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
MARKING DIAGRAMS
SOIC−16
D SUFFIX
CASE 751B
TSSOP−16
DT SUFFIX
CASE 948F
1
16
HC390AG
AWLYWW
HC
390A
ALYWG
G
1
16
A = Assembly Location
L, WL = Wafer Lot
Y, YY = Year
W, WW = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
SOIC−16 TSSOP−16
FUNCTION TABLE
Clock
A B Reset Action
X X H Reset
÷ 2 and ÷ 5
X L Increment
÷ 2
X L Increment
÷ 5
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
CLOCK B
b
Q
Ab
RESET b
CLOCK A
b
V
CC
Q
Db
Q
Cb
Q
Bb
CLOCK B
a
Q
Aa
RESET a
CLOCK A
a
GND
Q
Da
Q
Ca
Q
Ba
MC74HC390A
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2
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
CC
DC Supply Voltage (Referenced to GND) –0.5 to +7.0 V
V
in
DC Input Voltage (Referenced to GND) –0.5 to V
CC
+ 0.5 V
V
out
DC Output Voltage (Referenced to GND) –0.5 to V
CC
+ 0.5 V
I
in
DC Input Current, per Pin ±20 mA
I
out
DC Output Current, per Pin ±25 mA
I
CC
DC Supply Current, V
CC
and GND Pins ±50 mA
P
D
Power Dissipation in Still Air, SOIC Package†
TSSOP Package†
500
450
mW
T
stg
Storage Temperature –65 to +150
_C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
SOIC or TSSOP Package
260
_C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of
these limits are exceeded, device functionality should not be assumed, damage may occur and
reliability may be affected.
Derating: SOIC Package: –7 mW/_C from 65_ to 125_C
TSSOP Package: −6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
CC
DC Supply Voltage (Referenced to GND) 2.0 6.0 V
V
in
, V
out
DC Input Voltage, Output Voltage (Referenced to GND) 0 V
CC
V
T
A
Operating Temperature, All Package Types –55 +125
_C
t
r
, t
f
Input Rise and Fall Time V
CC
= 2.0 V
(Figure 1) V
CC
= 3.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
0
0
0
0
1000
600
500
400
ns
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Parameter Test Conditions
V
CC
V
Guaranteed Limit
Unit
–55 to
25_C
v85_C v125_C
V
IH
Minimum High−Level Input
Voltage
V
out
= 0.1 V or V
CC
– 0.1 V
|I
out
| v 20 mA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
V
IL
Maximum Low−Level Input
Voltage
V
out
= 0.1 V or V
CC
– 0.1 V
|I
out
| v 20 mA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
V
OH
Minimum High−Level Output
Voltage
V
in
= V
IH
or V
IL
|I
out
| v 20 mA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
V
in
= V
IH
or V
IL
|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
V
OL
Maximum Low−Level Output
Voltage
V
in
= V
IH
or V
IL
|I
out
| v 20 mA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
V
in
= V
IH
or V
IL
|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, V
in
and
V
out
should be constrained to the
range GND v (V
in
or V
out
) v V
CC
.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V
CC
).
Unused outputs must be left open.
MC74HC390A
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3
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) (continued)
Symbol Unit
Guaranteed Limit
V
CC
V
Test ConditionsParameter
Symbol Unit
v125_Cv85_C
–55 to
25_C
V
CC
V
Test ConditionsParameter
I
in
Maximum Input Leakage
Current
V
in
= V
CC
or GND 6.0 ±0.1 ±1.0 ±1.0
mA
I
CC
Maximum Quiescent Supply
Current (per Package)
V
in
= V
CC
or GND
I
out
= 0 mA
6.0 4 40 160
mA
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input t
f
= t
f
= 6 ns)
Symbol
Parameter
V
CC
V
Guaranteed Limit
Unit
–55 to
25_C
v85_C v125_C
f
max
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 3)
2.0
3.0
4.5
6.0
10
15
30
50
9
14
28
45
8
12
25
40
MHz
t
PLH
,
t
PHL
Maximum Propagation Delay, Clock A to QA
(Figures 1 and 3)
2.0
3.0
4.5
6.0
70
40
24
20
80
45
30
26
90
50
36
31
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Clock A to QC
(QA connected to Clock B)
(Figures 1 and 3)
2.0
3.0
4.5
6.0
200
160
58
49
250
185
65
62
300
210
70
68
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Clock B to QB
(Figures 1 and 3)
2.0
3.0
4.5
6.0
70
40
26
22
80
45
33
28
90
50
39
33
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Clock B to QC
(Figures 1 and 3)
2.0
3.0
4.5
6.0
90
56
37
31
105
70
46
39
180
100
56
48
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Clock B to QD
(Figures 1 and 3)
2.0
3.0
4.5
6.0
70
40
26
22
80
45
33
28
90
50
39
33
ns
t
PHL
Maximum Propagation Delay, Reset to any Q
(Figures 2 and 3)
2.0
3.0
4.5
6.0
80
48
30
26
95
65
38
33
110
75
44
39
ns
t
TLH
,
t
THL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
15
110
36
22
19
ns
C
in
Maximum Input Capacitance 10 10 10 pF
C
PD
Power Dissipation Capacitance (Per Counter)*
Typical @ 25°C, V
CC
= 5.0 V
pF
35
* Used to determine the no−load dynamic power consumption: P
D
= C
PD
V
CC
2
f + I
CC
V
CC
.

MC74HC390ADR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Counter Shift Registers 2-6V Dual 4-Stage Binary w/Divide-by-2
Lifecycle:
New from this manufacturer.
Delivery:
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