LFTVS18-1F3

Characteristics LFTVS18-1F3
4/8 Doc ID 14608 Rev 3
Figure 10. Junction capacitance versus line
voltage (typical values)
Figure 11. Junction capacitance versus
frequency for different bias
voltages (P = -12 dBm)
1M 3M 10M 30M 100M
0
20
40
60
80
100
120
140
160
180
200
F (Hz)
0.0V 2.0V
4.0V 6.0V
8.0V 10.0V
12.0V 14.0V
Capacitance(pF)
Figure 12. Breakdown voltage versus initial
junction temperature (typical value)
Figure 13. S21 insertion losses versus
frequency response
Figure 14. ESD response to IEC 61000-4-2
(+8 kV contact discharge)
Figure 15. ESD response to IEC 61000-4-2
(-8 kV contact discharge)
V (V)
BR
16
17
18
19
-50 -25 0 25 50 75 100 125 150
Vbr @ 1mA
(-30°C to 125°C)
T (° C)
j
100k 1M 10M 100M 1G
-60
-55
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
F/Hz
S21 (dB)
IEC61000-4-2: +8kV contact discharge
Voltage/Division: 10V
Time/Division: 20ns
Vpp@ peak: 27.5V
Vpp@ 100ns: 18.6V
IEC61000-4-2: -8kV contact discharge
Voltage/Division: 5V
Time/Division: 20ns
Vpp@ peak: -11.3V
Vpp@ 100ns: -1.4V
LFTVS18-1F3 Ordering information scheme
Doc ID 14608 Rev 3 5/8
2 Ordering information scheme
Figure 16. Ordering information scheme
LF TVS 18 - 1 F3
Low forward voltage
Transient voltage suppressor
Breakdown voltage
Number of lines
Package
18 = 18 V
MAX
1 = single line
F = Flip Chip
3 = Lead-free, pitch = 400 µm
Package information LFTVS18-1F3
6/8 Doc ID 14608 Rev 3
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 17. Package dimensions
Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
Figure 18. Foot print recommendations Figure 19. Marking
185 µm ± 10
185 µm ± 10
0.77 mm ± 30 µm
0.77 mm ± 30 µm
400 µm ± 40
255 µm ± 40
205 µm ± 40
400 µm ± 40
605 µm ± 55
220 µm recommended
220 µm recommended
260 µm maximum
Solder stencil opening:
Copper pad Diameter:
Solder mask opening:
300 µm minimum
x
y
z
w
x
w
Dot,
xx = marking
yww = datecode
y = year,
ww = week
z = manufacturing
location

LFTVS18-1F3

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
TVS Diodes / ESD Suppressors LO FWD TRANS VLT TRANSIL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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