NXP Semiconductors
BGU8051
Low noise high linearity amplifier
BGU8051 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 7 — 8 June 2017
COMPANY PUBLIC 11 / 16
Table 10. Typical performance BGU8051 application board V
CC
= 5 V
All RF parameters are measured at the application board as shown in Figure 16 with the components as listed in Table 9
while optimized for: f = 900 MHz, V
CC
= 5 V, I
CC
= 48 mA and T
amb
= 25 °C. Unless otherwise specified.
f (MHz)Symbol Parameter Conditions
400 500 700 750 800 900 1500
G gain 24.6 23.0 20.4 19.8 19.3 18.3 14.1
RL
in
input return loss 9.3 11.0 13.7 14.2 14.7 15.9 20.7
RL
out
output return loss 15.0 18.0 23.5 24.8 26.1 29.0 23.7
P
L(1dB)
output power at 1 dB gain
compression
17.9 18.8 19.8 18.7 19.4 19.4 18.5
[1]
35.5 37.9 39.5 39.6 39.8 39.9 39.2IP3
O
output third-order intercept point
[1]
[2]
35.6 37.2 38.8 39.3 39.1 39.8 38.2
NF noise figure
[3]
0.41 0.39 0.40 0.39 0.37 0.40 0.43
[1] For 2 Tone: tone spacing = 1MHZ, Po=5 dBm per tone
[2] For applications where fast switching is required, the value of C1 and C2 should be changed to 100 pF.
[3] Connector and board losses not de-embedded.
Table 11. Typical performance BGU8051 application board V
CC
= 3.3 V
All RF parameters measured at application board shown in Figure 16. The components listed in Table 9 optimized for 1900
MHz; V
CC
=3.3 V; I
CC
= 48 mA; T
amb
= 25 °C.
f (MHz)Symbol Parameter Conditions
400 500 700 750 800 900 1500
G gain 24.5 22.9 20.4 19.8 19.3 18.2 14.0
RL
in
input return loss 9.1 10.5 14.1 13.5 14.1 14.3 19.2
RL
out
output return loss 16.8 18.1 22.3 22.4 24.1 25.0 26.5
P
L(1dB)
output power at 1 dB gain
compression
15.9 16.4 16.6 16.1 16.3 16.3 15.4
[1]
32.4 34.3 35.5 34.5 34.1 35.3 31.6IP3
O
output third-order intercept point
[1]
[2]
32.4 33.1 33.6 33.6 33.1 33.2 30.2
NF noise figure
[3]
0.39 0.40 0.42 0.43 0.44 0.44 0.43
[1] For 2 Tone: tone spacing = 1MHZ, Po=5 dBm per tone
[2] For applications where fast switching is required, the value of C1 and C2 should be changed to 100 pF.
[3] Connector and board losses not de-embedded.
