BYQ28E-200E,127

BYQ28E-200E All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 14 July 2011 3 of 11
NXP Semiconductors
BYQ28E-200E
Dual ultrafast power diodes
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
RRM
repetitive peak reverse voltage - 200 V
V
RWM
crest working reverse voltage - 200 V
V
R
reverse voltage DC - 200 V
I
O(AV)
average output current square-wave pulse; δ = 0.5 ; T
mb
119 °C;
both diodes conducting; see Figure 1;
see Figure 2
-10A
I
FRM
repetitive peak forward current δ =0.5; t
p
= 25 µs; T
mb
119 °C; per diode;
square-wave pulse
-10A
I
FSM
non-repetitive peak forward
current
t
p
= 8.3 ms; sine-wave pulse; T
j(init)
=2C;
per diode
-55A
t
p
= 10 ms; sine-wave pulse; T
j(init)
=2C;
per diode
-50A
I
RRM
repetitive peak reverse current δ = 0.001 ; t
p
=2µs - 0.2 A
I
RSM
non-repetitive peak reverse
current
t
p
= 100 µs - 0.2 A
T
stg
storage temperature -40 150 °C
T
j
junction temperature - 150 °C
Electrostatic discharge
V
ESD
electrostatic discharge voltage HBM; C = 250 pF; R = 1.5 k; all pins - 8 kV
Fig 1. Forward power dissipation as a function of
average forward current; square waveform;
maximum values
Fig 2. Forward power dissipation as a function of
average forward current; sinusoidal waveform;
maximum values
I
F(AV)
(A)
08624
001aag976
4
2
6
8
P
tot
(W)
0
δ = 1
0.2
0.1
0.5
001aag977
I
F(AV)
(A)
0642
2
4
6
P
tot
(W)
0
a = 1.57
2.2
2.8
4.0
1.9
BYQ28E-200E All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 14 July 2011 4 of 11
NXP Semiconductors
BYQ28E-200E
Dual ultrafast power diodes
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from junction
to mounting base
with heatsink compound; both diodes
conducting
--3K/W
with heatsink compound; per diode;
see Figure 3
--4.5K/W
R
th(j-a)
thermal resistance from junction
to ambient
-60-K/W
Fig 3. Transient thermal impedance from junction to mounting base as a function of pulse width
001aag979
10
1
10
2
1
10
Z
th(j-mb)
(K/W)
10
3
t
p
(s)
10
6
1 1010
1
10
2
10
5
10
3
10
4
t
p
t
p
T
P
t
T
δ =
BYQ28E-200E All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 14 July 2011 5 of 11
NXP Semiconductors
BYQ28E-200E
Dual ultrafast power diodes
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
F
forward voltage I
F
=5A; T
j
=2C; see Figure 4 - 0.95 1.1 V
I
F
=5A; T
j
= 150 °C; see Figure 4 - 0.8 0.895 V
I
F
=10A; T
j
=2C; see Figure 4 - 1.1 1.25 V
I
R
reverse current V
R
= 200 V; T
j
=2C - 2 10 µA
V
R
= 200 V; T
j
= 100 °C - 0.1 0.2 mA
Dynamic characteristics
Q
r
recovered charge I
F
=2A; V
R
30 V; dI
F
/dt = 20 A/µs;
T
j
= 25 °C; see Figure 5
- 49nC
t
rr
reverse recovery time I
F
=1A; V
R
=30V; dI
F
/dt = 100 A/µs;
ramp recovery; T
j
=2C; see Figure 5
- 1525ns
I
F
=0.5A; I
R
= 1 A; step recovery;
T
j
= 25 °C; see Figure 6
- 1020ns
I
RM
peak reverse recovery
current
I
F
=2A; V
R
30 V; dI
F
/dt = 20 A/µs;
T
j
= 25 °C; see Figure 5
-0.40.7A
V
FR
forward recovery voltage I
F
=1A; dI
F
/dt = 10 A/µs; T
j
=2C;
see Figure 7
-1-V
Fig 4. Forward current as a function of forward
voltage
Fig 5. Reverse recovery definitions; ramp recovery
001aag978
V
F
(V)
0 1.51.00.5
5
10
15
I
F
(A)
0
(3)(2)(1)

BYQ28E-200E,127

Mfr. #:
Manufacturer:
WeEn Semiconductors
Description:
Rectifiers DUAL ULTRAFAST PWR DIODE
Lifecycle:
New from this manufacturer.
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