16
FN9151.5
February 13, 2008
function to the compensation transfer function and plotting
the gain.
The compensation gain uses external impedance networks
Z
FB
and Z
IN
to provide a stable, high bandwidth (BW) overall
loop. A stable control loop has a gain crossing with -
20dB/decade slope and a phase margin greater than 45°.
Include worst case component variations when determining
phase margin.
Component Selection Guidelines
Output Capacitor Selection
An output capacitor is required to filter the output and supply
the load transient current. The filtering requirements are a
function of the switching frequency and the ripple current.
The load transient requirements are a function of the slew
rate (di/dt) and the magnitude of the transient load current.
These requirements are generally met with a mix of
capacitors and careful layout.
Modern microprocessors produce transient load rates above
1A/ns. High frequency capacitors initially supply the transient
and slow the current load rate seen by the bulk capacitors.
The bulk filter capacitor values are generally determined by
the ESR (effective series resistance) and voltage rating
requirements rather than actual capacitance requirements.
High frequency decoupling capacitors should be placed as
close to the power pins of the load as physically possible. Be
careful not to add inductance in the circuit board wiring that
could cancel the usefulness of these low inductance
components. Consult with the manufacturer of the load on
specific decoupling requirements. For example, Intel
recommends that the high frequency decoupling for the
Pentium Pro be composed of at least forty (40) 1.0µF
ceramic capacitors in the 1206 surface-mount package.
Use only specialized low-ESR capacitors intended for
switching-regulator applications for the bulk capacitors.
The bulk capacitor’s ESR will determine the output ripple
voltage and the initial voltage drop after a high slew-rate
transient. An aluminum electrolytic capacitor's ESR value is
related to the case size with lower ESR available in larger
case sizes. However, the equivalent series inductance (ESL)
of these capacitors increases with case size and can reduce
the usefulness of the capacitor to high slew-rate transient
loading. Unfortunately, ESL is not a specified parameter.
Work with your capacitor supplier and measure the
capacitor’s impedance with frequency to select a suitable
component. In most cases, multiple electrolytic capacitors of
small case size perform better than a single large case
capacitor.
Output Inductor Selection
The output inductor is selected to meet the output voltage
ripple requirements and minimize the converter’s response
time to the load transients. The inductor value determines
the converter’s ripple current and the ripple voltage is a
function of the ripple current and the output capacitors ESR.
The ripple voltage and current are approximated by the
following equations:
Increasing the value of inductance reduces the ripple current
and voltage. However, larger inductance values reduce the
converter’s response time to a load transient.
One of the parameters limiting the converter’s response to a
load transient is the time required to change the inductor
current. Given a sufficiently fast control loop design, the
ISL6420 will provide either 0% or 100% duty cycle in
response to a load transient. The response time is the time
required to slew the inductor current from an initial current
value to the transient current level. During this interval the
difference between the inductor current and the transient
current level must be supplied by the output capacitor.
Minimizing the response time can minimize the output
capacitance required.
The response time to a transient is different for the
application of load and the removal of load. The following
equations give the approximate response time interval for
application and removal of a transient load:
where: I
TRAN
is the transient load current step, t
RISE
is the
response time to the application of load, and t
FALL
is the
response time to the removal of load. With a +5V input
source, the worst case response time can be either at the
application or removal of load and dependent upon the
100
80
60
40
20
0
-20
-40
-60
F
P1
F
Z2
10M1M100k10k1k10010
OPEN LOOP
ERROR AMP GAIN
F
Z1
F
P2
F
LC
F
ESR
COMPENSATION
GAIN (dB)
FREQUENCY (Hz)
GAIN
20LOG
(V
IN
/ΔV
OSC
)
MODULATOR
GAIN
20LOG
(R2/R1)
LOOP GAIN
FIGURE 16. ASYMPTOTIC BODE PLOT OF CONVERTER GAIN
I
L
V
IN
- V
OUT
Fs x L
--------------------------------
V
OUT
V
IN
----------------
=Δ
(EQ. 10)
V
OUT
Δ I
L
Δ ESR=
(EQ. 11)
t
RISE
L
O
I
TRAN
×
V
IN
V
OUT
------------------------------- -
=
(EQ. 12)
t
FALL
L
O
I
TRAN
×
V
OUT
-------------------------------
=
(EQ. 13)
ISL6420
17
FN9151.5
February 13, 2008
output voltage setting. Be sure to check both of these
equations at the minimum and maximum output levels for
the worst case response time.
Input Capacitor Selection
Use a mix of input bypass capacitors to control the voltage
overshoot across the MOSFETs. Use small ceramic
capacitors for high frequency decoupling and bulk capacitors
to supply the current needed each time Q1 turns on. Place the
small ceramic capacitors physically close to the MOSFETs
and between the drain of Q1 and the source of Q2.
The important parameters for the bulk input capacitor are the
voltage rating and the RMS current rating. For reliable
operation, select the bulk capacitor with voltage and current
ratings above the maximum input voltage and largest RMS
current required by the circuit. The capacitor voltage rating
should be at least 1.25 times greater than the maximum
input voltage and a voltage rating of 1.5 times is a
conservative guideline. The RMS current rating requirement
for the input capacitor of a buck regulator is approximately
1/2 the DC load current. A more specific equation for
determining the input ripple is the following,
For a through hole design, several electrolytic capacitors
(Panasonic HFQ series or Nichicon PL series or Sanyo
MV-GX or equivalent) may be needed. For surface mount
designs, solid tantalum capacitors can be used, but caution
must be exercised with regard to the capacitor surge current
rating. These capacitors must be capable of handling the
surge-current at power-up. The TPS series available from
AVX, and the 593D series from Sprague are both surge
current tested.
MOSFET Selection/Considerations
The ISL6420 requires 2 N-Channel power MOSFETs. These
should be selected based upon r
DS(ON)
, gate supply
requirements, and thermal management requirements.
In high-current applications, the MOSFET power dissipation,
package selection and heatsink are the dominant design
factors. The power dissipation includes two loss
components; conduction loss and switching loss.
The conduction losses are the largest component of power
dissipation for both the upper and the lower MOSFETs.
These losses are distributed between the two MOSFETs
according to duty factor (see the equations below). Only the
upper MOSFET has switching losses, since the Schottky
rectifier clamps the switching node before the synchronous
rectifier turns on.
Where D is the duty cycle = Vo/Vin, tsw is the switching
interval, and Fsw is the switching frequency.
These equations assume linear voltage-current transitions
and do not adequately model power loss due the reverse-
recovery of the lower MOSFETs body diode. The
gate-charge losses are dissipated by the ISL6420 and don't
heat the MOSFETs. However, large gate-charge increases
the switching interval, t
SW
which increases the upper
MOSFET switching losses. Ensure that both MOSFETs are
within their maximum junction temperature at high ambient
temperature by calculating the temperature rise according to
package thermal-resistance specifications. A separate
heatsink may be necessary depending upon MOSFET
power, package type, ambient temperature and air flow.
Schottky Selection
Rectifier D2 is a clamp that catches the negative inductor
swing during the dead time between turning off the lower
MOSFET and turning on the upper MOSFET. The diode must
be a Schottky type to prevent the parasitic MOSFET body
diode from conducting. It is acceptable to omit the diode and
let the body diode of the lower MOSFET clamp the negative
inductor swing, but efficiency will drop one or two percent as a
result. The diode's rated reverse breakdown voltage must be
greater than the maximum input voltage.
I
RMS
I
MAX
DD
2
()=
(EQ. 14)
P
UFET
I
O
2
R
DS ON()
D
1
2
---
I
O
V
IN
t
sw
f
sw
⋅⋅+⋅⋅=
(EQ. 15)
P
LFET
I
O
2
R
DS ON()
1D()⋅⋅=
(EQ. 16)
ISL6420
18
FN9151.5
February 13, 2008
ISL6420
Package Outline Drawing
L20.4x4
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 11/06
located within the zone indicated. The pin #1 identifier may be
Unless otherwise specified, tolerance : Decimal ± 0.05
Tiebar shown (if present) is a non-functional feature.
The configuration of the pin #1 identifier is optional, but must be
between 0.15mm and 0.30mm from the terminal tip.
Dimension b applies to the metallized terminal and is measured
Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
6.
either a mold or mark feature.
3.
5.
4.
2.
Dimensions are in millimeters.1.
NOTES:
BOTTOM VIEW
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
BOTTOM VIEW
SIDE VIEW
4.00
A
4.00
B
6
PIN 1
INDEX AREA
(4X)
0.15
4X
0.50
2.0
16X
2016
15
11
PIN #1 INDEX AREA
6
2 . 10 ± 0 . 15
5
1
0.25 +0.05 / -0.07
0.10 M ABC
20X 0.6 +0.15 / -0.25
4
6
10
BASE PLANE
SEATING PLANE
0.10
SEE DETAIL "X"
0.08 C
C
C
0 . 90 ± 0 . 1
0 . 2 REF
C
0 . 05 MAX.
0 . 00 MIN.
5
( 3. 6 TYP )
( 2. 10 )
( 20X 0 . 8)
( 20X 0 . 5 )
( 20X 0 . 25 )

ISL6420IRZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers SYNCH BUCK PWM CONT W/4 5V-16V INPUT20LD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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