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152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
4 ©2008 Micron Technology, Inc. All rights reserved.
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
General Description
Preliminary
General Description
Micron package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM
devices in a single MCP. These products target mobile applications with low-power,
high-performance, and minimal package-footprint design requirements. The NAND
Flash and Mobile LPDRAM devices are also members of the Micron discrete memory
products portfolio.
The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces (no
shared address, control, data, or power balls). This bus architecture supports an opti
-
mized interface to processors with separate NAND Flash and Mobile LPDRAM buses.
The NAND Flash and Mobile LPDRAM devices have separate core power connections
and share a common ground (i.e., V
SS
is tied together on the two devices).
The bus architecture of this device also supports separate NAND Flash and Mobile
LPDRAM functionality without concern for device interaction. Operational characteris
-
tics for the NAND Flash and Mobile LPDRAM devices are found in the standard Micron
data sheets for each of the discrete devices.
For device specifications and complete Micron NAND Flash features documentation,
please refer to the component data sheet at
www.micron.com/products/nand, or con-
tact your local Micron sales office.
For device specifications and complete Mobile LPDRAM features documentation,
please refer to the component data sheet at
www.micron.com/products/mobiledram, or
contact your local Micron sales office.