TLP705A
10
13.
13.
13.
13. Soldering and Storage
Soldering and Storage
Soldering and Storage
Soldering and Storage
13.1.
13.1.
13.1.
13.1. Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig.
Fig.
Fig.
Fig. 13.1.1
13.1.1
13.1.1
13.1.1 An Example of a Temperature Profile
An Example of a Temperature Profile
An Example of a Temperature Profile
An Example of a Temperature Profile
When Sn-Pb Eutectic Solder Is Used
When Sn-Pb Eutectic Solder Is Used
When Sn-Pb Eutectic Solder Is Used
When Sn-Pb Eutectic Solder Is Used
Fig.
Fig.
Fig.
Fig. 13.1.2
13.1.2
13.1.2
13.1.2 An Example of a Temperature Profile
An Example of a Temperature Profile
An Example of a Temperature Profile
An Example of a Temperature Profile
When Lead(Pb)-Free Solder Is Used
When Lead(Pb)-Free Solder Is Used
When Lead(Pb)-Free Solder Is Used
When Lead(Pb)-Free Solder Is Used
• When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2.
13.2.
13.2.
13.2. Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
2015-12-25
Rev.5.0
©2015 Toshiba Corporation
