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NCV8184DR2G

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
NCV8184
http://onsemi.com
16
40
45
50
55
60
65
70
75
80
85
90
0 100 200 300 400 500 600 700
Figure 33. DPAK 5−Lead, θ
JA
as a Function of the
Pad Copper Area, Board Material FR4
q
JA
(°C/W)
COPPER HEAT SPREADER AREA (mm
2
)
1.0 oz Cu
2.0 oz Cu
T
J
= 25°C
0.1
1
10
100
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Figure 34. DPAK 5−Lead Thermal Duty Cycle Curves
on 1.0 in Spreader Test Board, 1.0 oz Cu
PULSE TIME (sec)
50% Duty Cycle
20%
Single Pulse
10%
5%
2%
1%
(1.0 in pad PCB) Die Size = 2.08 x 1.55 x 0.40 5.0% Active Area
Duty Cycle, D =
t
1
t
2
P
DM
Notes:
t
1
t
2
R(t) (°C/W)
0.1
1
10
100
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
PULSE TIME (sec)
Figure 35. DPAK 5−Lead Single Pulse Heating Curve
Cu Area 645 mm
2
Cu Area 100 mm
2
R(t) (°C/W)
NCV8184
http://onsemi.com
17
Junction
Ambient
(thermal ground)
R
1
R
2
C
1
C
2
C
3
C
n
R
n
R
3
Time constants are not simple RC products.
Amplitudes of mathematical solution are not the resistance values.
Figure 36. Grounded Capacitor Thermal Network (“Cauer” Ladder)
Figure 37. Non−Grounded Capacitor Thermal Ladder (“Foster” Ladder)
Junction
Ambient
(thermal ground)
R
1
R
2
C
1
C
2
C
3
C
n
R
n
R
3
Each rung is exactly characterized by its RC−product time constant;
Amplitudes are the resistances
ORDERING INFORMATION
Device Order Number Package Type Shipping
†
NCV8184DG SOIC−8
(Pb−Free)
98 Units / Tube
NCV8184DR2G SOIC−8
(Pb−Free)
2500 / Tape & Reel
NCV8184DTRKG DPAK
(Pb−Free)
2500 / Tape & Reel
NCV8184PDG SOIC−8 epad
(Pb−Free)
98 Units / Tube
NCV8184PDR2G SOIC−8 epad
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCV8184
http://onsemi.com
18
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒ
mm
inches
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
SEATING
PLANE
1
4
58
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) Z
S
X
S
M
____
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

NCV8184DR2G

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Manufacturer:
ON Semiconductor
Description:
LDO Voltage Regulators 70mA Tracking
Lifecycle:
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