ESD217-B1-02EL
Package Information
Final Data Sheet 10 Revision 1.1, 2014-11-11
4 Package Information
4.1 TSLP-2-19
Figure 4-1 TSLP-2-19 Package outline
Figure 4-2 TSLP-2-19 Footprint
Figure 4-3 TSLP-2-19 Packing
Figure 4-4 TSLP-2-19 Marking example, Type code see: Table 1-1 “Part Information” on Page 3
TSLP-2-19, -20-PO V01
±0.05
0.6
1
2
±0.05
0.65
±0.035
0.25
1)
1
±0.05
0.05 MAX.
+0.01
0.31
-0.02
1) Dimension applies to plated terminals
Pin 1
marking
1)
±0.035
0.5
Bottom viewTop view
TSLP-2-19, -20-FP V01
0.45
0.28
0.28
0.38
0.93
Copper Solder mask Stencil apertures
0.35
1
0.6
0.35
0.3
0.76
4
1.16
0.4
Pin 1
marking
8
TSLP-2-19, -20-TP V02
Type code
Pin 1 marking
TSLP-2-19, -20-MK V01
12
ESD217-B1-02EL
References
Final Data Sheet 7 Revision 1.1, 2014-11-11
References
[1] Infineon AG - Application Note AN210: Effective ESD Protection design at System Level Using VF-TLP
Characterization Methodology
[2] Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Packages
ESD217-B1-02EL
Final Data Sheet 2 Revision 1.1, 2014-11-11
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™,
CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™,
MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™,
PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™,
SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,
TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2010-10-26
Revision History Rev. 1.0, 2014-05-16
Page or Item Subjects (major changes since previous revision)
Revision 1.1, 2014-11-11
3 Table 1-1) updated

ATV06B400J-HF

Mfr. #:
Manufacturer:
Comchip Technology
Description:
TVS Diodes / ESD Suppressors 600W 40V UNIDIRECTION AECQ101
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet