NLAS6233MUTBG

NLAS6233
http://onsemi.com
7
Figure 11. I
CC
vs V
CC
Figure 12. t
ON
vs V
CC
Figure 13. t
OFF
vs V
CC
I
CC
(nA)
V
CC
(V)
3.5 4.02.5 3.01.5 2.00.5 1.00
150 E-9
50 E-9
-50 E-9
85°C
25°C
-40°C
4.5
T
ON
(ns)
V
CC
(V)
4.03.53.02.52.01.5
25
10
5
0
85°C
25°C
-40°C
5.0
T
OFF
(ns)
100 E-9
0 E+0
15
4.5
V
CC
(V)
85°C
25°C
-40°C
20
4.03.53.02.52.01.5
25
10
5
0
5.0
15
4.5
20
NLAS6233
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8
Popless Implementation on the NLAS6233
Audio sources such as amplifiers or CODECs can generate
undesirable, transient voltage spikes when powering up and
down. Those voltage spikes can be translated into current
surges and ultimately lead to audible pop noises in the speaker
if not diverted or suppressed. The NLAS6233 includes
popless noise suppression circuitry designed to prevent such
undesirable pops from propagating through to the speaker.
This feature is realized through a deliberate increase in the
Break-Before-Make time, t
BBM
, and is useful in applications
where a switch is used to alternate between two different
audio sources.
When the signal from the common pin is removed from
one terminal, the switch waits an extended amount of time
before connecting to the opposite terminal. The time interval
for t
BBM
is a function of the supply voltage of the switch,
V
CC
. Figure 14 shows the relationship of t
BBM
for each V
CC
value within the recommended operating voltage range.
Figure 14. NLAS6233 T
BBM
vs. V
CC
V
CC
(V)
T
BBM
(ms)
350
300
250
200
150
100
50
3.0 3.4 3.6 3.8 4.0 4.23.2
500
450
400
DEVICE ORDERING INFORMATION
Device Package Shipping
NLAS6233MUTBG UQFN10
(Pb-Free)
3000/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
NLAS6233
http://onsemi.com
9
PACKAGE DIMENSIONS
UQFN10, 1.4x1.8, 0.4P
CASE 488AT-01
ISSUE A
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A
b
A1
0.05
C
SEATING
PLANE
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
DIM MIN MAX
MILLIMETERS
A
1.40 BSC
A1
0.40 BSC
0.45 0.60
b
D
0.30 0.50
E
e
L
L1
0.00 0.05
PIN 1 REFERENCE
D A
E
B
0.10 C
2X
0.10 C
2X
0.05 C
C
L3
10
1
3
5
6
0.05 C
0.10
CAB
10 X
e
e/2
L9 X
0.00 0.15
1.80 BSC
0.15 0.25
10X
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L3
0.40 0.60
0.127 REFA3
TOP VIEW
SIDE VIEW
BOTTOM VIEW
MOUNTING FOOTPRINT
10 X
PITCH
1
9 X
SCALE 20:1
0.663
0.0261
0.200
0.0079
0.400
0.0157
0.225
0.0089
2.100
0.0827
1.700
0.0669
0.563
0.0221
ǒ
mm
inches
Ǔ
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800-282-9855 Toll Free
 USA/Canada
Europe, Middle East and Africa Technical Support:
 Phone: 421 33 790 2910
Japan Customer Focus Center
 Phone: 81-3-5773-3850
NLAS6233/D
LITERATURE FULFILLMENT:
 Literature Distribution Center for ON Semiconductor
 P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative

NLAS6233MUTBG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC SWITCH DUAL DPDT 16UQFN
Lifecycle:
New from this manufacturer.
Delivery:
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