IRF2805PBF

IRF2805PbF
HEXFET
®
Power MOSFET
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 0.45
R
θCS
Case-to-Sink, Flat, Greased Surface 0.50 ––– °C/W
R
θJA
Junction-to-Ambient ––– 62
Thermal Resistance
V
DSS
= 55V
R
DS(on)
= 4.7m
I
D
= 75A
07/22/10
www.irf.com 1
TO-220AB
HEXFET(R) is a registered trademark of International Rectifier.
S
D
G
Description
l Advanced Process Technology
l Ultra Low On-Resistance
l 175°C Operating Temperature
l Fast Switching
l Repetitive Avalanche Allowed up to Tjmax
l Lead-Free
Typical Applications
l Industrial Motor Drive
This HEXFET
®
Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per silicon
area. Additional features of this design are a 175°C junction
operating temperature, fast switching speed and improved
repetitive avalanche rating . These features combine to make
this design an extremely efficient and reliable device for use
in a wide variety of applications.
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V (Silicon limited) 175
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V (See Fig.9) 120 A
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V (Package limited) 75
I
DM
Pulsed Drain Current 700
P
D
@T
C
= 25°C Power Dissipation 330 W
Linear Derating Factor 2.2 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 450 mJ
E
AS
(6 sigma) Single Pulse Avalanche Energy Tested Value 1220
I
AR
Avalanche Current See Fig.12a, 12b, 15, 16 A
E
AR
Repetitive Avalanche Energy mJ
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Mounting Torque, 6-32 or M3 screw 1.1 (10) N•m (lbf•in)
Absolute Maximum Ratings
Features
PD - 95493A
IRF2805PbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 55 –– –– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.06 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– 3.9 4.7 m V
GS
= 10V, I
D
= 104A
V
GS(th)
Gate Threshold Voltage 2.0 ––– 4.0 V V
DS
= 10V, I
D
= 250µA
g
fs
Forward Transconductance 91 ––– ––– S V
DS
= 25V, I
D
= 104A
––– ––– 20
µA
V
DS
= 55V, V
GS
= 0V
––– ––– 250 V
DS
= 55V, V
GS
= 0V, T
J
= 125°C
Gate-to-Source Forward Leakage ––– ––– 200 V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -200
nA
V
GS
= -20V
Q
g
Total Gate Charge –– 150 230 I
D
= 104A
Q
gs
Gate-to-Source Charge ––– 38 57 nC V
DS
= 44V
Q
gd
Gate-to-Drain ("Miller") Charge ––– 52 78 V
GS
= 10V
t
d(on)
Turn-On Delay Time ––– 14 ––– V
DD
= 28V
t
r
Rise Time ––– 120 ––– I
D
= 104A
t
d(off)
Turn-Off Delay Time ––– 68 ––– R
G
= 2.5
t
f
Fall Time ––– 110 –– V
GS
= 10V
Between lead,
––– –––
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 5110 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 1190 ––– pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 210 –– ƒ = 1.0MHz, See Fig. 5
C
oss
Output Capacitance ––– 6470 ––– V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
C
oss
Output Capacitance ––– 860 –– V
GS
= 0V, V
DS
= 44V, ƒ = 1.0MHz
C
oss
eff. Effective Output Capacitance ––– 1600 ––– V
GS
= 0V, V
DS
= 0V to 44V
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance ––– –––
S
D
G
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11).
Starting T
J
= 25°C, L = 0.08mH
R
G
= 25, I
AS
= 104A. (See Figure 12).
I
SD
104A, di/dt 240A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Pulse width 400µs; duty cycle 2%.
Notes:
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C, I
S
= 104A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 80 120 ns T
J
= 25°C, I
F
= 104A
Q
rr
Reverse Recovery Charge ––– 290 430 nC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
175
700
A
C
oss
eff. is a fixed capacitance that gives the same charging time
as C
oss
while V
DS
is rising from 0 to 80% V
DSS
.
Limited by T
Jmax
, see Fig.12a, 12b, 15, 16 for typical repetitive
avalanche performance.
This value determined from sample failure population. 100%
tested to this value in production.
IRF2805PbF
www.irf.com 3
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
4.0 5. 0 6. 0 7. 0 8. 0 9.0 10. 0
V
GS
, Gate-to-Source Voltage (V)
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
T
J
= 25°C
T
J
= 175°C
V
DS
= 25V
20µs PULSE WIDTH
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
1
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
4.5V
20µs PULSE WIDTH
Tj = 25°C
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
4.5V
20µs PULSE WIDTH
Tj = 175°C
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
Fig 4. Typical Forward Transconductance
Vs. Drain Current
0 40 80 120 160 200
I
D,
Drain-to-Source Current (A)
0
40
80
120
160
200
G
f
s
,
F
o
r
w
a
r
d
T
r
a
n
s
c
o
n
d
u
c
t
a
n
c
e
(
S
)
T
J
= 25°C
T
J
= 175°C
V
DS
= 25V
20µs PULSE WIDTH

IRF2805PBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT 55V 175A 4.7mOhm 150nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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