TSML1000, TSML1020, TSML1030, TSML1040
www.vishay.com
Vishay Semiconductors
Rev. 2.1, 13-Mar-14
4
Document Number: 81033
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 9 - Relative Radiant Intensity vs. Angular Displacement
PRECAUTIONS FOR USE
1. Over-current-proof
Customer must apply resistors for protection, otherwise
slight voltage shift will cause big current change (burn out
will happen).
2. Storage
• Storage temperature and rel. humidity conditions are: 5
°C to 35 °C, R.H. 60 %.
• Floor life must not exceed 168 h, acc. to JEDEC level 3,
J-STD-020.
Once the package is opened, the products should be
used within a week. Otherwise, they should be kept in a
damp proof box with desiccant.
Considering tape life, we suggest to use products within
one year from production date.
• If opened more than one week in an atmosphere 5 °C to
35 °C, R.H. 60 %, devices should be treated at 60 °C ±
5 °C for 15 h.
• If humidity indicator in the package shows pink color
(normal blue), then devices should be treated with the
same conditions as 2.3.
REFLOW SOLDER PROFILE
Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile
Fig. 11 - Lead (Pb)-Free Reflow Solder Profile acc. J-STD-020
I
e rel
- Relative Intensity
18234
0.6
0.9
0.8
0°
30°
10° 20°
40°
50°
60°
70°
80°
0.7
1.0
0.6
0.4
0.2
0
0.2
0.4
60
80
100
120
140
160
180
200
220
240
260
0 20 40 60 80 100 120 140 160 180 200 220
Time (s)
Temperature (°C)
17172
+ 5 °C/s
5 s
60 s to 120 s
- 5 °C/s
22566
120 s max.
60 s max.
above 220 °C
260 °C max.
10 s max.
Pre-heating
180 °C to 200 °C
1 °C/s to 5 °C/s
1 °C/s to 5 °C/s
