2016 Microchip Technology Inc. DS20005598A-page 7
PL130-07
3.0 PACKAGING INFORMATION
8 Lead TSSOP Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PL130-07
DS20005598A-page 8 2016 Microchip Technology Inc.
8-Lead SOIC Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2016 Microchip Technology Inc. DS20005598A-page 9
PL130-07
16-Lead QFN 3 mm x 3 mm Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.

PL130-07SI

Mfr. #:
Manufacturer:
Microchip Technology / Micrel
Description:
Clock Buffer High Speed Translator Buffer to LVCMOS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union