NCP4545
www.onsemi.com
2
PIN DESCRIPTION
Pin Name Function
1 DELAY Turn−on delay adjustment
2 V
CC
Supply voltage to controller (3.0 V − 5.5 V)
3 GND Controller ground
4, 5, 9−14, 18, 19 V
IN
Drain of MOSFET (0.5 V − 6.0 V)
6−8 V
OUT
Source of MOSFET connected to load
15 BLEED Load bleed connection
16 EN
NCP4545IMNTWG − Active−High digital input used to turn on the MOSFET, pin
has an internal pull down resistor to GND
NCP4545IMNTWG−L − Active−Low digital input used to turn on the MOSFET,
pin has an internal pull up resistor to V
CC
17 SR Slew rate adjustment
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Supply Voltage Range V
CC
−0.3 to 6 V
Input Voltage Range V
IN
−0.3 to 6 V
Output Voltage Range V
OUT
−0.3 to 6 V
EN Digital Input Range V
EN
−0.3 to (V
CC
+ 0.3) V
Thermal Resistance, Junction−to−Air (Note 1)
R
q
JA
49.9 °C/W
Thermal Resistance, Junction−to−Air (Note 2)
R
q
JA
32.8 °C/W
Thermal Resistance, Junction−to−Case (V
IN
Paddle)
R
q
JC
3.3 °C/W
Continuous MOSFET Current (Note 3) I
MAX
10.5 A
Total Power Dissipation @ T
A
= 25°C (Notes 1 and 4)
Derate above T
A
= 25°C
P
D
1.30
20.1
W
mW/°C
Total Power Dissipation @ T
A
= 25°C (Notes 2 and 4)
Derate above T
A
= 25°C
P
D
1.98
30.5
W
mW/°C
Storage Temperature Range T
STG
−40 to 150 °C
Lead Temperature, Soldering (10 sec.) T
SLD
260 °C
ESD Capability, Human Body Model (Notes 5 and 6) ESD
HBM
4.0 kV
ESD Capability, Machine Model (Note 5) ESD
MM
200 V
ESD Capability, Charged Device Model (Note 5) ESD
CDM
1 kV
Latch−up Current Immunity (Note 5) LU 100 mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Surface−mounted on FR4 board using the minimum recommended pad size, 1 oz Cu.
2. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
3. Current limited by package.
4. Specified for derating purposes only, ensure that I
MAX
is never exceeded.
5. Tested by the following methods @ T
A
= 25°C:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per EIA/JESD22−A115
ESD Charged Device Model per EIA/JESD22−C101
Latch−up Current Maximum Rating: ≤100 mA per JEDEC standard: JESD78
6. Rating is for all pins except for V
IN
and V
OUT
which are tied to the internal MOSFET’s Drain and Source. Typical MOSFET ESD performance
for V
IN
and V
OUT
should be expected and these devices should be treated as ESD sensitive.
