NCP4545
www.onsemi.com
11
PACKAGE DIMENSIONS
QFN18, 3x3, 0.5P
CASE 485BF
ISSUE O
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
PIN 1
REFERENCE
A
B
C0.15
TOP VIEW
D
E
C0.15
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E2
BOTTOM VIEW
b
0.10
18X
L
1
5
0.05
C AB
C
D2
e
K
4
13
18X
(A3)
C
C0.08
C0.10
SIDE VIEW
A1
A
SEATING
PLANE
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 1.75 1.95
E 3.00 BSC
E2 1.75 1.95
e 0.50 BSC
K 0.20 −−−
L 0.275 0.375
NOTE 3
L1
DETAIL A
DETAIL B
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L
OPTIONAL
CONSTRUCTION
OPTIONAL
CONSTRUCTION
L1 0.00 0.15
NOTE 4
DETAIL B
3.30
18X
DIMENSION: MILLIMETERS
0.53
1.95
1.95
0.50
PITCH
18X
0.31
MOUNTING FOOTPRINT
DETAIL A
3.30
L
9
10
18
PACKAGE
OUTLINE
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NCP4545/D
ecoSWITCH is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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