19
Rev: C Date:2/1/06 SP526 Multi–Mode Serial Transceiver © Copyright 2006 Sipex Corporation
Phase 4
— V
DD
transfer — The fourth phase of the clock
connects the negative terminal of C
2
to ground,
and transfers the generated l0V across C
2
to C
4
,
the V
DD
storage capacitor. Again, simultaneously
with this, the positive side of capacitor C
1
is
switched to +5V and the negative side is con-
nected to ground, and the cycle begins again.
Since both V
+
and V
are separately generated
from V
CC
; in a no–load condition V
+
and V
will
be symmetrical. Older charge pump approaches
that generate V
from V
+
will show a decrease in
the magnitude of V
compared to V
+
due to the
inherent inefficiencies in the design.
The clock rate for the charge pump typically
operates at 15kHz. The external capacitors can
be as low as 1.0µF with a 16V breakdown
voltage rating.
ESD Tolerance
The SP526 device incorporates ruggedized
ESD cells on all driver output and receiver input
pins. The ESD structure is improved over our
previous family for more rugged applications
and environments sensitive to electro-static
discharges and associated transients. The
improved ESD tolerance is at least ±15kV
without damage nor latch-up.
There are different methods of ESD testing
applied:
a) MIL-STD-883, Method 3015.7
b) IEC1000-4-2 Air-Discharge
c) IEC1000-4-2 Direct Contact
The Human Body Model has been the generally
accepted ESD testing method for semiconductors.
This method is also specified in MIL-STD-883,
Method 3015.7 for ESD testing. The premise of
this ESD test is to simulate the human body’s
potential to store electro-static energy and
discharge it to an integrated circuit. The
simulation is performed by using a test model as
shown in Figure 35. This method will test the
IC’s capability to withstand an ESD transient
during normal handling such as in manufacturing
areas where the ICs tend to be handled frequently.
The IEC-1000-4-2, formerly IEC801-2, is
generally used for testing ESD on equipment and
systems. For system manufacturers, they must
guarantee a certain amount of ESD protection
since the system itself is exposed to the outside
environment and human presence. The premise
with IEC1000-4-2 is that the system is required
to withstand an amount of static electricity when
ESD is applied to points and surfaces of the
equipment that are accessible to personnel during
normal usage. The transceiver IC receives most
R
C
SW
DC Power
Source
C
S
R
S
SW2
Device
Under
Test
Figure 35. ESD Test Circuit for Human Body Model
20
Rev: C Date:2/1/06 SP526 Multi–Mode Serial Transceiver © Copyright 2006 Sipex Corporation
-
30A
15A
0A
t=0nS
t=30nS
t
Figure 37. ESD Test Waveform for IEC1000-4-2
of the ESD current when the ESD source is
applied to the connector pins. The test circuit for
IEC1000-4-2 is shown on Figure 36. There are
two methods within IEC1000-4-2, the Air
Discharge method and the Contact Discharge
method.
With the Air Discharge Method, an ESD voltage
is applied to the equipment under test (EUT)
through air. This simulates an electrically charged
person ready to connect a cable onto the rear of
the system only to find an unpleasant zap just
before the person touches the back panel. The
high energy potential on the person discharges
through an arcing path to the rear panel of the
system before he or she even touches the system.
This energy, whether discharged directly or
through air, is predominantly a function of the
discharge current rather than the discharge
voltage. Variables with an air discharge such as
approach speed of the object carrying the ESD
Table 2. Transceiver ESD Tolerance Levels
Device Pin Human Body IEC1000-4-2
Tested Model Air Discharge Direct Contact Level
Driver Outputs ±15kV ±15kV ±8kV 4
Receiver Inputs ±15kV ±15kV ±8kV 4
R
C
C
S
R
S
R
V
SW1
SW2
Contact-Discharge Module
Device
Under
Test
DC Power
Source
RS and RV add up to 330 for IEC1000-4-2
Figure 36. ESD Test Circuit for IEC1000-4-2
21
Rev: C Date:2/1/06 SP526 Multi–Mode Serial Transceiver © Copyright 2006 Sipex Corporation
potential to the system and humidity will tend to
change the discharge current. For example, the
rise time of the discharge current varies with the
approach speed.
The Contact Discharge Method applies the ESD
current directly to the EUT. This method was
devised to reduce the unpredictability of the
ESD arc. The discharge current rise time is
constant since the energy is directly transferred
without the air-gap arc. In situations such as
hand held systems, the ESD charge can be directly
discharged to the equipment from a person already
holding the equipment. The current is transferred
on to the keypad or the serial port of the equipment
directly and then travels through the PCB and
finally to the IC.
The circuit models in Figures 35 and 36 represent
the typical ESD testing circuits used for all three
methods. The C
S
is initially charged with the DC
power supply when the first switch (SW1) is on.
Now that the capacitor is charged, the second
switch (SW2) is on while SW1 switches off. The
voltage stored in the capacitor is then applied
through R
S
, the current limiting resistor, onto the
device under test (DUT). In ESD tests, the SW2
switch is pulsed so that the device under test
receives a duration of voltage.
For the Human Body Model, the current limiting
resistor (R
S
) and the source capacitor (C
S
) are
1.5k an 100pF, respectively. For IEC-1000-4-
2, the current limiting resistor (R
S
) and the source
capacitor (C
S
) are 330 an 150pF, respectively.
The higher C
S
value and lower R
S
value in the
IEC1000-4-2 model are more stringent than the
Human Body Model. The larger storage capacitor
injects a higher voltage to the test point when
SW2 is switched on. The lower current limiting
resistor increases the current charge onto the test
point.
NET1/NET2 European Compliancy
As with all of Sipex's previous multi-protocol
serial transceiver ICs, the drivers and receivers
have been designed to meet all the requirements
to NET1/NET2. The SP526 is also tested and
adheres to all the NET1/2 physical layer testing
and the ITU Series V specifications. Please note
that although the SP526, as with its predecessors,
adheres to NET1/2 testing, any complex or
unusual configuration should be double-checked
to ensure NET compliance. Consult the factory
for details.

SP526CF-L

Mfr. #:
Manufacturer:
MaxLinear
Description:
IC TXRX WAN MULTI-MODE 44LQFP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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