4
FN6494.0
April 25, 2008
Absolute Maximum Ratings Thermal Information
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V
EN
, V
PWM
) . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (V
BOOT-GND
). . . -0.3V to 25V (DC) or 36V (<200ns)
BOOT To PHASE Voltage (V
BOOT-PHASE
). . . . . . -0.3V to 7V (DC)
-0.3V to 9V (<10ns)
PHASE Voltage . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 15V (DC)
GND -8V (<20ns Pulse Width, 10µJ) to 30V (<100ns)
UGATE Voltage . . . . . . . . . . . . . . . . V
PHASE
- 0.3V (DC) to V
BOOT
V
PHASE
- 5V (<20ns Pulse Width, 10µJ) to V
BOOT
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
GND - 2.5V (<20ns Pulse Width, 5µJ) to VCC + 0.3V
Ambient Temperature Range. . . . . . . . . . . . . . . . . .-40°C to +125°C
Thermal Resistance θ
JA
(°C/W) θ
JC
(°C/W)
SOIC Package (Note 1) . . . . . . . . . . . . 100 N/A
DFN Package (Notes 2, 3). . . . . . . . . . 48 7
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature Range
ISL6620IBZ, ISL6620IRZ, ISL6620AIBZ, ISL6620AIRZ
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
ISL6620CBZ, ISL6620CRZ, ISL6620ACBZ, ISL6620ACRZ
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air.
2. θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For θ
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Recommended Operating Conditions; Parameters with MIN and/or MAX limits are 100% tested at +25°C,
unless otherwise specified. Temperature limits established by characterization and are not production
tested.
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
VCC Supply Current
No Load Switching Supply Current IVCC f_PWM = 300kHz, V_VCC = 5V 1.27 mA
Standby Supply Current IVCC PWM 0V to 2.5V transition, EN = High 1.85 mA
PWM 0V to 2.5V transition, EN = Low 1.15 mA
POWER-ON RESET AND ENABLE
VCC Rising POR Threshold 3.2 3.8 4.4 V
VCC Falling POR Threshold 3.0 3.4 4.0 V
VCC POR Hysteresis 130 300 530 mV
EN High Threshold 1.40 1.65 1.90 V
EN Low Threshold 1.20 1.35 1.55 V
PWM INPUT (See TIMING DIAGRAM" on page 6)
Input Current IPWM VPWM = 5V 500 µA
VPWM = 0V -430 µA
PWM Rising Threshold (Note 4) VCC = 5V 3.4 V
PWM Falling Threshold (Note 4) VCC = 5V 1.6 V
Three-State Lower Gate Falling Threshold VCC = 5V 1.6 V
Three-State Lower Gate Rising Threshold VCC = 5V 1.1 V
Three-State Upper Gate Rising Threshold VCC = 5V 3.2 V
Three-state Upper Gate Falling Threshold VCC = 5V 2.8 V
UGATE Rise Time (Note 4) t_RU VCC = 5V, 3nF load, 10% to 90% 8 ns
ISL6620, ISL6620A
5
FN6494.0
April 25, 2008
LGATE Rise Time (Note 4) t_RL VCC = 5V, 3nF load, 10% to 90% 8 ns
UGATE Fall Time (Note 4) t_FU VCC = 5V, 3nF load, 10% to 90% 8 ns
LGATE Fall Time (Note 4) t_FL VCC = 5V, 3nF load, 10% to 90% 4 ns
UGATE Turn-On Propagation Delay (Note 4) t_PDHU VCC = 5V, 3nF load, adaptive 40 ns
LGATE Turn-On Propagation Delay (Note 4) t_PDHL VCC = 5V, 3nF load, adaptive 23 ns
UGATE Turn-Off Propagation Delay (Note 4) t_PDLU VCC = 5V, 3nF load 18 ns
LGATE Turn-Off Propagation Delay (Note 4) t_PDLL VCC = 5V, 3nF load 25 ns
Minimum Lgate on time at Diode emulation t_LG_ON_DM VCC = 5V 230 330 450 ns
OUTPUT (Note 4)
Upper Drive Source Current I_U_Source VCC = 5V, 3nF load 2 A
Upper Drive Source Impedance R_U_SOURCE 20mA source current 1 Ω
Upper Drive Sink Current I_U_SINK VCC = 5V, 3nF load 2 A
Upper Drive Sink Impedance R_U_SINK 20mA sink current 1 Ω
Lower Drive Source Current I_L_SOURCE VCC = 5V, 3nF load 2 A
Lower Drive Source Impedance R_L_SOURCE 20mA source current 1 Ω
Lower Drive Sink Current I_L_SINK VCC = 5V, 3nF load 4 A
Lower Drive Sink Impedance R_L_SINK 20mA sink current 0.4 Ω
NOTE:
4. Limits should be considered typical and are not production tested.
Electrical Specifications Recommended Operating Conditions; Parameters with MIN and/or MAX limits are 100% tested at +25°C,
unless otherwise specified. Temperature limits established by characterization and are not production
tested. (Continued)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Functional Pin Description
PACKAGE PIN #
PIN
SYMBOL FUNCTIONSOIC DFN
1 1 UGATE Upper gate drive output. Connect to gate of high-side power N-Channel MOSFET.
2 2 BOOT Floating bootstrap supply pin for the upper gate drive. Connect the bootstrap capacitor between this pin and the
PHASE pin. The bootstrap capacitor provides the charge to turn on the upper MOSFET. See “Internal Bootstrap
Device” on page 7 for guidance in choosing the capacitor value.
- 3, 8 NC No connect.
3 4 PWM The PWM signal is the control input for the driver. The PWM signal can enter three distinct states during operation.
See “Advanced PWM Protocol (Patent Pending)” on page 6 for further details. Connect this pin to the PWM output
of the controller.
4 5 GND Bias and reference ground. All signals are referenced to this node. It is also the power-ground return of the driver.
5 6 LGATE Lower gate drive output. Connect to gate of the low-side power N-Channel MOSFET.
6 7 VCC Connect this pin to 5V bias supply. This pin supplies power to the upper gate and lower gate drive. Place a high
quality low ESR ceramic capacitor from this pin to GND.
7 9 EN Enable input pin. Connect this pin high to enable driver and low to disable driver.
8 10 PHASE Connect this pin to the SOURCE of the upper MOSFET and the DRAIN of the lower MOSFET. This pin provides
a return path for the upper gate drive.
- 11 PAD Connect this pad to the power ground plane (GND) via thermally enhanced connection.
ISL6620, ISL6620A
6
FN6494.0
April 25, 2008
Description
Operation and Adaptive Shoot-through Protection
Designed for high speed switching, the ISL6620, ISL6620A
MOSFET driver controls both high-side and low-side
N-Channel FETs from one externally provided PWM signal.
A rising transition on PWM initiates the turn-off of the lower
MOSFET (see Timing Diagram). After a short propagation
delay [t
PDLL
], the lower gate begins to fall. Typical fall times
[t
FL
] are provided in the “Electrical Specifications” table on
page 4. Adaptive shoot-through circuitry monitors the LGATE
voltage and turns on the upper gate following a short delay
time [t
PDHU
] after the LGATE voltage drops below ~1V. The
upper gate drive then begins to rise [t
RU
] and the upper
MOSFET turns on.
A falling transition on PWM indicates the turn-off of the upper
MOSFET and the turn-on of the lower MOSFET. A short
propagation delay [t
PDLU
] is encountered before the upper gate
begins to fall [t
FU
]. The adaptive shoot-through circuitry
monitors the UGATE-PHASE voltage and turns on the lower
MOSFET a short delay time [t
PDHL
], after the upper MOSFET’s
gate voltage drops below 1V. The lower gate then rises [t
RL
],
turning on the lower MOSFET. These methods prevent both the
lower and upper MOSFETs from conducting simultaneously
(shoot-through), while adapting the dead time to the gate
charge characteristics of the MOSFETs being used.
This driver is optimized for voltage regulators with large step
down ratio. The lower MOSFET is usually sized larger
compared to the upper MOSFET because the lower MOSFET
conducts for a longer time during a switching period. The
lower gate driver is therefore sized much larger to meet this
application requirement. The 0.4Ω ON-resistance and 4A sink
current capability enable the lower gate driver to absorb the
current injected into the lower gate through the drain-to-gate
capacitor of the lower MOSFET and help prevent
shoot-through caused by the self turn-on of the lower
MOSFET due to high dV/dt of the switching node.
Advanced PWM Protocol (Patent Pending)
The advanced PWM protocol of ISL6620, ISL6620A is
specifically designed to work with Intersil VR11.1 controllers.
When ISL6620, ISL6620A detects a PSI
protocol sent by an
Intersil VR11.1 controller, it turns on diode emulation
operation; otherwise, it remains in normal CCM PWM mode.
The controller communicates the tri-state signal to the driver
by transitioning the PWM signal from 0V to 2V. The driver
recognizes Diode Emulation mode and after 330ns
(typically) evaluates the PHASE voltage to detect negative
current, thus turning off LGATE. With no further PWM pulses
from the controller, both UGATE and LGATE are low and the
output can shut down. This feature helps prevent a negative
transient on the output voltage when the output is shut down,
eliminating the Schottky diode that is used in some systems
for protecting the load from reversed output voltage events.
Otherwise, the PWM rising and falling thresholds outlined in
the “Electrical Specifications” on page 4 determine when the
lower and upper gates are enabled.
Note that the LGATE will not turn off until the diode emulation
minimum LGATE ON-time of 350ns is expired for a PWM low
to tri-level (2.5V) transition.
Diode Emulation
Diode emulation allows for higher converter efficiency under
light-load situations. With diode emulation active, the
ISL6620, ISL6620A detects the zero current crossing of the
output inductor and turns off LGATE. This prevents the low
side MOSFET from sinking current and ensures that
discontinuous conduction mode (DCM) is achieved. The
LGATE has a minimum ON-time of 350ns in DCM mode.
PWM
UGATE
LGATE
t
PDLL
t
PDHU
t
RU
t
PDLU
t
PDHL
t
RL
1V
2.5V
t
RU
t
FU
t
FL
1V
t
PTS
t
TSSHD
t
TSSHD
t
PTS
FIGURE 1. TIMING DIAGRAM
ISL6620, ISL6620A

ISL6620AIRZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers SYNCH BUCK MSFT 5V DRVR3OHM R BOOT VR11
Lifecycle:
New from this manufacturer.
Delivery:
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