JANSF2N2222AL

TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0042 Rev. 3 (100247) Page 4 of 7
PACKAGE DIMENSIONS
NOTES:
Dimensions
1. Dimensions are in inches. Symbol Inches Millimeters Note
2. Millimeters are given for general information only. Min Max Min Max
3. Beyond r (radius) maximum, TL shall be held for a minimum length CD .178 .195 4.52 4.95
of .011 inch (0.28 mm). CH .170 .210 4.32 5.33
4. Dimension TL measured from maximum HD. HD .209 .230 5.31 5.84
5. Body contour optional within zone defined by HD, CD, and Q. LC .100 TP 2.54 TP 6
6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) LD .016 .021 0.41 0.53 7,8
below seating plane shall be within .007 inch (0.18 mm) radius of LL .500 .750 12.70 19.05 7,8,13
true position (TP) at maximum material condition (MMC) relative to LU .016 .019 0.41 0.48 7,8
tab at MMC. L
1
.050 1.27 7,8
7. Dimension LU applies between L
1
and L
2
. Dimension LD applies L
2
.250 6.35 7,8
between L
2
and LL minimum. Diameter is uncontrolled in L
1
and P .100 2.54
beyond LL minimum. Q .030 0.76 5
8. All three leads. TL .028 .048 0.71 1.22 3,4
9. The collector shall be internally connected to the case. TW .036 .046 0.91 1.17 3
10. Dimension r (radius) applies to both inside corners of tab. r .010 0.25 10
11. In accordance with ASME Y14.5M, diameters are equivalent to φx
α
45° TP 45° TP
6
symbology. 1, 2, 9, 11, 12, 13
12. Lead 1 = emitter, lead 2 = base, lead 3 = collector.
13. For L suffix devices, dimension LL = 1.5 inches (38.10 mm) min.
and 1.75 inches (44.45 mm) max.
FIGURE 1. Physical dimensions (similar to TO-18).
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0042 Rev. 3 (100247) Page 5 of 7
NOTES:
Dimensions
1. Dimensions are in inches.
Symbol
Inches Millimeters
Note
2. Millimeters are given for general information only.
Min Max Min Max
3. Dimension CH controls the overall package thickness. When a BL .215 .225 5.46 5.71
window lid is used, dimension CH must increase by a minimum of BL2
.225 5.71
.010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm). BW .145 .155 3.68 3.93
4. The corner shape (square, notch, radius) may vary at the BW2
.155 3.93
manufacturer's option, from that shown on the drawing. CH .061 .075 1.55 1.90 3
5. Dimensions LW2 minimum and L3 minimum and the appropriate L3
.003 .007 0.08 0.18 5
castellation length define an unobstructed three-dimensional space LH .029 .042 0.74 1.07
traversing all of the ceramic layers in which a castellation was LL1
.032 .048 0.81 1.22
designed. (Castellations are required on the bottom two layers, LL2
.072 .088 1.83 2.23
optional on the top ceramic layer.) Dimension LW2 maximum and LS .045 .055 1.14 1.39
L3 maximum define the maximum width and depth of the LW .022 .028 0.56 0.71
castellation at any point on its surface. Measurement of these LW2
.006 .022 0.15 0.56 5
dimensions may be made prior to solder dipping.
6. The co-planarity deviation of all terminal contact points, as defined
by the device seating plane, shall not exceed .006 inch (0.15mm) for Pin no. 1 2 3 4
solder dipped leadless chip carriers. Transistor Collector Emitter Base N/C
7. In accordance with ASME Y14.5M, diameters are equivalent to φx
symbology.
FIGURE 2. Physical dimensions, surface mount (UA version).
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0042 Rev. 3 (100247) Page 6 of 7
Dimensions
Dimensions
Symbol Inches Millimeters Note
Symbol
Inches Millimeters
Note
Min Max Min Max
Min Max Min Max
BH .046 .056 1.17 1.42
LS
1
.036 .040 0.91 1.02
BL .115 .128 2.92 3.25
LS
2
.071 .079 1.81 2.01
BW .085 .108 2.16 2.74
LW .016 .024 0.41 0.61
CL .128 3.25
r .008 .203
CW .108 2.74
r
1
.012 .305
LL1 .022 .038 0.56 0.96
r
2
.022 .559
LL2 .017 .035 0.43 0.89
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Hatched areas on package denote metalized areas.
4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid.
5. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
FIGURE 3. Physical dimensions, surface mount (UB version)
UB

JANSF2N2222AL

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
Bipolar Transistors - BJT BJTs
Lifecycle:
New from this manufacturer.
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